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Semiconductor device including heat sink

A technology of semiconductors and heat sinks, applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve problems such as increased power loss density

Active Publication Date: 2016-01-20
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, the current density of power electronics continues to increase, which leads to an increase in the density of power losses

Method used

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  • Semiconductor device including heat sink
  • Semiconductor device including heat sink
  • Semiconductor device including heat sink

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Experimental program
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Embodiment Construction

[0018] In the following detailed description, reference is made to the accompanying drawings which form a part hereof, and in which are shown by way of illustrations specific embodiments in which the disclosure may be practiced. In this regard, directional terms such as "top", "bottom", "front", "rear", "in front", "in rear", etc. are referenced to the Figure(s) in which they are being described used for orientation. Since components of an embodiment may be positioned in several different orientations, directional terms are used for illustration purposes and are in no way limiting. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present disclosure. The following detailed description is therefore not to be viewed in a limiting sense, and the scope of the disclosure is defined by the appended claims.

[0019] It is to be understood that the features of the various exemplary embo...

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Abstract

The present invention relates to a semiconductor device including a heat sink. A semiconductor device includes: a semiconductor chip including a backside metal; a substrate; and a conductive heat spreader directly contacting the backside metal. The semiconductor chip includes a sintered joint that directly contacts the heat sink and electrically couples the heat sink to the substrate.

Description

technical field [0001] The present invention relates to the field of semiconductor devices, in particular to semiconductor devices including heat sinks. Background technique [0002] Power electronic modules are semiconductor packages used in power electronic circuits. Power electronic modules are commonly used in vehicle and industrial applications, such as in inverters and rectifiers. Semiconductor components included in power electronic modules are typically insulated gate bipolar transistor (IGBT) semiconductor chips or metal oxide semiconductor field effect transistor (MOSFET) semiconductor chips. IGBT and MOSFET semiconductor chips have varying voltage and current ratings. Some power electronics modules also include additional semiconductor diodes (ie freewheeling diodes) in the semiconductor package for overvoltage protection. [0003] Generally, two different power electronics module designs are used. One design is for higher power applications and the other is f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/373H01L21/48H01L21/50
CPCH01L23/051H01L23/057H01L23/24H01L24/05H01L24/06H01L24/29H01L24/32H01L24/33H01L25/072H01L2224/04026H01L2224/0508H01L2224/05083H01L2224/05124H01L2224/05139H01L2224/05144H01L2224/05155H01L2224/05171H01L2224/05639H01L2224/05647H01L2224/05693H01L2224/06181H01L2224/27505H01L2224/29139H01L2224/29144H01L2224/29147H01L2224/32113H01L2224/32225H01L2224/33181H01L2224/4811H01L2224/48177H01L2224/48229H01L2224/73265H01L2924/01012H01L2924/01013H01L2924/01029H01L2924/01047H01L2924/0105H01L2924/01079H01L2924/01082H01L2924/014H01L2924/10253H01L2224/29H01L2224/29298H01L2224/32245H01L2224/48227H01L2224/48247H01L2924/01005H01L2924/01006H01L2924/01019H01L2924/01024H01L2924/01033H01L2924/01074H01L2224/29101H01L2924/0132H01L2924/0133H01L2924/13091H01L23/36H01L23/3735H01L2224/29111H01L2224/8384H01L23/373H01L23/49811H01L24/45H01L24/48H01L24/73H01L24/85H01L2224/45124H01L2224/45144H01L2224/45147H01L2224/85205H01L2924/13055H01L2224/48647H01L2224/48839H01L2224/48847H01L2224/48639H01L2224/48739H01L2224/48747H01L2924/01014H01L2924/01028H01L2224/48472H01L2224/48091H01L2224/83439H01L2224/83444H01L2224/83455H01L2224/83464H01L2924/15747H01L2924/00013H01L2924/1306H01L2924/1305H01L2224/04042H01L2924/15787H01L2224/48893H01L2924/00011H01L2924/12043H01L2924/181H01L2924/00012H01L2924/00H01L2924/00014H01L2924/3512H01L2224/48793H01L2224/48693H01L2224/29099H01L2224/29199H01L2224/29299H01L2224/2929H01L2224/83205
Inventor R.巴耶雷尔
Owner INFINEON TECH AG