Method for manufacturing rigid-flexible combined circuit board capable of protecting inner-layer soft board

Abstract

The invention discloses a method for manufacturing a rigid-flexible combined circuit board capable of protecting an inner-layer flexible board. The method comprises the following steps of: etching a copper pad at one side of a rigid board coreboard, which is not in contact with a flexible board coreboard; attaching a windowed prepreg to one side of the rigid board coreboard, which is in contact with the flexible board coreboard; and carrying out laser cutting at the inner side of a window of the prepreg, and enabling the cutting region to be correspondingly positioned inside the copper pad. Compared with the prior art, the method disclosed by the invention has the advantages of effectively preventing the rigid plate coreboard from being cutting through in the laser cutting process by utilizing the blocking of the copper pad and solving the problems of breaking of the rigid plate coreboard, board surface sinking after impressing and laminating on the surface of a flexible board, outer-layer pattern film cavity and the like when the rigid plate coreboard with the thickness being less than 0.3mm is made into the rigid-flexible combined circuit board.

Description

Technical field: [0001] The invention belongs to the technical field of circuit board production, and in particular relates to a method for producing a rigid-flex circuit board for protecting an inner soft board, in particular to a rigid-flex circuit board with a core board thickness not greater than 0.3mm. Background technique: [0002] With the development of electronic products in the direction of high density, miniaturization and high reliability, flexible and rigid circuit boards are suitable for light, thin, short , Small feature requirements. [0003] Rigid-flex circuit boards, that is, printed boards in which soft boards and rigid boards are connected, refer to circuit boards made of flexible substrates and interconnected with rigid substrates in different areas. In the soft and hard bonding area, the conductive patterns on the flexible substrate and the rigid substrate are usually interconnected. It not only has the rigidity of a hard board for easy assembly, but ...

AI Technical Summary

Problems solved by technology

[0005] For this reason, the object of the present invention is to provide a kind of method for making the soft-rigid circuit board that protects the inner layer flexible board, to solve the hard core board that thickness is less than 0.3mm when carrying out the flexible-rigid circuit board production, the rigidity that exists. The core board is broken, the board surface is sunken after lamination, the outer graphic film is hollow, and the soft board is embossed, etc.

Images