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Method for ultrasonic detection of bonding quality of thin-walled metal and non-metal material

A technology for non-metallic materials and bonding quality, which is used in the analysis of solids and materials using sonic/ultrasonic/infrasonic waves, and material analysis using sonic/ultrasonic/infrasonic waves. It can solve the problems of inaccurate quantitative evaluation and low detection sensitivity. , to achieve the effect of improving quality reliability and use safety, high detection rate, and accurate quantification

Inactive Publication Date: 2012-07-25
湖北三江航天江北机械工程有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention aims at the problems of low detection sensitivity and inaccurate qualitative and quantitative assessment existing in the currently used thin-walled metal and non-metallic material bonding quality detection method, and provides an ultrasonic detection method for thin-walled metal and non-metallic material bonding quality, which improves The detection sensitivity and defect qualitative and quantitative accuracy of the bonding quality detection method of thin-walled metal and non-metallic materials ensure that the detection results meet the quality control requirements of materials and products

Method used

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  • Method for ultrasonic detection of bonding quality of thin-walled metal and non-metal material
  • Method for ultrasonic detection of bonding quality of thin-walled metal and non-metal material
  • Method for ultrasonic detection of bonding quality of thin-walled metal and non-metal material

Examples

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Effect test

Embodiment 1

[0043] Example 1: When testing the bonding quality of a ZTC4 cast titanium alloy cylindrical shell with an outer diameter of φ300mm and a wall thickness of 3.0mm and a high-silica molded material bonding product, the acceptance technical requirements stipulate that no single area is greater than 2000mm 2 If the debonding defect exists, according to the metal structure of the inspected product, the sound attenuation characteristics of the material and the inspection accuracy requirements, the inspection frequency of the probe can be selected as 2.25MHz.

Embodiment 2

[0044] Example 2: When testing the bonding quality of a ZL104 cast aluminum alloy plate ring with an outer diameter of φ600mm, an inner diameter of 200mm, and a thickness of 5.0mm, and a rubber material bonding product, the technical requirements for acceptance shall not have a single area greater than 800mm 2 If the debonding defect exists, according to the metal structure of the inspected product, the sound attenuation characteristics of the material and the detection accuracy requirements, the detection frequency of the probe can be selected as 3MHz.

Embodiment 3

[0045] Example 3: When testing the bonding quality of a steel forging cone shell with an outer diameter of φ450mm at the large end, an outer diameter at the small end of 300mm, and a wall thickness of 4.0mm, and a carbon fiber braided material bonding product, the acceptance technical requirements stipulate that there must be no single area Greater than 400mm 2 If the debonding defect exists, according to the metal structure of the inspected product, the sound attenuation characteristics of the material and the detection accuracy requirements, the detection frequency of the probe can be selected as 5MHz.

[0046] (2) Chip size of the probe: The chip size of the probe is determined according to the external dimensions and structure of the detected thin-walled metal and non-metallic material products and the detection accuracy. While coupling, it should also meet the requirements of detection accuracy and have a good signal-to-noise ratio. When the thin-walled metal of the detec...

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Abstract

The invention discloses a method for ultrasonic detection of the bonding quality of thin-walled metal and a non-metal material, wherein an ultrasonic instrument is adopted for detection. The method comprises the steps of: firstly, making a comparative sample, and calibrating the sensitivity of the ultrasonic instrument according to a debonding defect testing hole in the comparative sample; then performing defect position testing on a product: detecting the bonding quality of the thin-waled metal and the non-metal material by adopting the calibrated ultrasonic instrument, placing an output port of a longitudinal wave probe of the ultrasonic instrument on an outer metal surface of the material product, and performing 100% scanning on a bonding face by adopting a moving scanning manner; and if the height of multiple pulse echoes of longitudinal waves at cells 6 to 10 of a horizontal baseline on a oscillography screen of the instrument is found to reach or exceed initial sensitivity during moving scanning, judging that a part below the probe has a debonding defect position or an adverse bonding defect, and if a height envelope curve of the multiple pulse echoes of the longitudinal waves at cells 6 to 10 of the horizontal baseline on the oscillography screen is lower than 50% and gradually decreases to 20% or no reflected waves exist, judging that the bonding quality is intact.

Description

technical field [0001] The invention relates to an ultrasonic testing method for bonding quality of thin-walled metals and non-metallic materials, belonging to the technical field of non-destructive testing, in particular to an ultrasonic testing method for bonding quality of thin-walled metals such as steel, aluminum and titanium and non-metallic materials. Background technique [0002] Thin-walled metal materials and non-metallic materials are bonded to form a new composite material, which makes the comprehensive performance better than the original metal materials and non-metallic materials. The thin-walled metal and non-metallic materials have high specific strength and good thermal insulation performance. And other characteristics, the conventional detection technology does not have complete effectiveness for its bonding quality detection, and the reliability of the detection results is low. [0003] The main production process of bonding thin-walled metal and non-metal...

Claims

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Application Information

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IPC IPC(8): G01N29/04G01N29/30
Inventor 王晓勇熊建平余天雄
Owner 湖北三江航天江北机械工程有限公司
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