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Packaging process for light-emitting diode (LED) with fluorescent glue film and LED packaging

A technology of LED packaging and fluorescent glue, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of uncontrollable production costs, unable to guarantee the light output rate of phosphor powder coating, and unable to control the concentration of white light color areas, etc., to improve Reliability and heat dissipation performance, color temperature concentration, self-absorption reduction effect

Inactive Publication Date: 2012-08-01
LEDMAN OPTOELECTRONICS
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  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

However, if figure 1 At present, the white light LED packaging technology in the same industry basically adopts the traditional method of filling the entire reflective cup to cover the chip, but this method cannot guarantee the uniformity of the entire phosphor coating and improve the light output rate, nor can it control the concentration of the white light color area. , making it impossible to control production costs

Method used

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  • Packaging process for light-emitting diode (LED) with fluorescent glue film and LED packaging
  • Packaging process for light-emitting diode (LED) with fluorescent glue film and LED packaging
  • Packaging process for light-emitting diode (LED) with fluorescent glue film and LED packaging

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Embodiment Construction

[0023] In order to describe the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.

[0024] see Figure 2-4 , The present invention relates to a fluorescent glue film-forming LED package, which includes a bracket 1, an LED flip chip 2, a wire 7, a crystal-bonding primer 3, 4 layers of silica gel, a coating of fluorescent glue 5 and a coating of silicone resin 6. Among them, the support 1 (also known as the receiving seat) has positive and negative poles, and the LED flip chip 2 is arranged on the support 1, and the lower part of the LED flip chip 2 is solidified on the support 1 through the crystal-fixing primer 3 around the bottom, preferably It fixes the LED flip-chip 2 on the bracket 1 through a high-performance heat-conducting crystal-fixing primer 3, preferably silver glue or solder paste with high thermal conductivit...

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Abstract

The invention provides a packaging process for an LED with a fluorescent glue film and an LED packaging, which comprises that an atomizing device is used for coating a flip-chip surface on which silica gel is already molded with the atomized fluorescent glue, the fluorescent glue is evenly adhered to the molded silica gel surface under the action of the gravity after airflows, and a novel fluorescent glue film structure is formed after being baked and cured at a high temperature. The packaging process does not change the optical property of an LED structure, effectively improves reliability and heat dissipation of the LED structure, reduces self-absorption of phosphor powder, and simultaneously, the structure can be adjusted by being coated repeatedly, so that the color temperature can be adjusted, the produced LED color temperature is concentrated, the cost is greatly reduced, the LED packaging is a simple and practical illuminating light source and is beneficial to popularization of LED lights.

Description

technical field [0001] The invention relates to the field of LED lighting, in particular to a fluorescent glue film-forming LED packaging process and LED packaging. Background technique [0002] As a new type of light source, white LED is widely used in buildings, solar street lights, flashlights, car lights, table lamps, backlights, spotlights, gardens, wall lights, etc. , Small-area decorative lighting for home furnishing and commercial lighting that integrates decoration and advertising. However, if figure 1 At present, the white light LED packaging technology in the same industry basically adopts the traditional method of filling the entire reflective cup to cover the chip, but this method cannot guarantee the uniformity of the entire phosphor coating and improve the light output rate, nor can it control the concentration of the white light color area. , making it impossible to control production costs. Contents of the invention [0003] The object of the present in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/50H01L33/52
Inventor 李漫铁王绍芳周杰孟牧冯珍
Owner LEDMAN OPTOELECTRONICS
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