Locating crystal support for cutting polycrystalline silicon ingot

Abstract

The invention relates to a locating crystal support for cutting a polycrystalline silicon ingot, which comprises a base plate, a side face locking device, an angle locking device and the polycrystalline silicon ingot, wherein a support seat is arranged on the bottom end of the base plate; an adhesive hole is arranged in a box; two fixed counter bores are arranged in a side face locating module; a fixed counter bore is arranged in the center of an angle locating module; the side face locking device is arranged on the side face locating module; and the angle locking device is arranged on the angle locating module. According to the crystal support, the most effective stability function can be played on the polycrystalline silicon ingot, the location is accurate, the processing of linear cutting cannot be affected, the base plate cannot be abraded easily in a long-time use process, and the service life of the base plate is greatly prolonged.

Description

Technical field: [0001] The invention relates to the field of polycrystalline silicon, in particular to a positioning crystal holder for polycrystalline silicon ingot cutting. Background technique: [0002] The sun contains inexhaustible energy for human beings. The sun is constantly sending huge energy into the universe. According to calculations, the energy emitted in just one second is equivalent to the heat released when 130 million tons of standard coal is burned. The solar energy that reaches the earth's surface is roughly equivalent to 200,000 times the sum of all power generation capacities in the world. The solar energy received by the earth every day is equivalent to 200 times the total energy consumed by the whole world in a year. Compared with other energy sources, solar energy does not produce toxic and harmful gases and waste residues, so it does not pollute the environment. At the same time, sunlight can be obtained everywhere, and it is convenient and saf...

AI Technical Summary

Problems solved by technology

[0004] ① Only the first screw is fixed on the bottom plate, while the positioning and pressing force of the second screw on the polysilicon ingot is relatively large, so that the force between the stud of the first screw and the threaded hole on the bottom plate is concentrated, and it is easy to cause the bottom plate to be damaged. The threaded hole on the screw is worn or damaged, and in severe cases, the first screw will be broken.

[0005] ②There is a threaded hole on the top of the first screw for screwing the second screw. , the first screw will be turned, creating false compression

[0006] It can be seen from this that the existing locking device for cutting polycrystalline silicon ingots is unreasonable in design, unreliable in positioning and clamping, and has a short service life.

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