Method for producing goldfinger via twice electroplating

A gold finger and gold finger guiding wire technology, which is applied in the reinforcement of conductive patterns, the secondary treatment of printed circuits, the formation of electrical connections of printed components, etc., can solve the problems that affect production efficiency and product quality, short circuit of gold fingers, gold seepage during electroplating, etc. problems, to achieve the effect of ensuring quality, avoiding gold seepage, and shortening the time

Inactive Publication Date: 2012-08-15
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0005] In view of the above problems, the object of the present invention is to provide a method for making gold fingers by two-time electroplating, so as to solve the problem of gold infiltration caused by too l

Method used

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Embodiment Construction

[0025] In order to illustrate the idea and purpose of the present invention, the present invention will be further described below in conjunction with specific embodiments.

[0026] The invention provides a method for making gold fingers by double electroplating, which mainly improves the gold finger electroplating of circuit boards, so that the previous gold finger electroplating process is divided into first electroplating a nickel layer, then electroplating a thin gold layer, and finally electroplating a thick gold finger. The process of the gold layer, because the gold finger is electroplated with thin gold, takes a short time, so it can effectively avoid the short circuit problem of gold penetration and circuit graphics.

[0027] Wherein the present invention specifically adopts following steps:

[0028] A. Perform silk screen solder mask, exposure and development on the surface of the circuit board, and post-baking to harden the silk screen solder mask layer.

[0029] A...

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Abstract

The invention discloses a method for producing a goldfinger via twice electroplating, comprising the following steps: B, carrying out screen printing on dielectric gold oil ink on the lead part of the goldfinger; C, pasting a dry film on the line graph area of a circuit board for protection and exposing the goldfinger part; D, carrying out electronickelling processing on the goldfinger part, forming a nickel layer on the goldfinger, then electroplating flash gold and forming a flash gold layer on the nickel layer; and E, electroplating heavy gold on the goldfinger part and forming a heavy gold layer on the flash gold layer. According to the invention, the nickel layer, the flash gold layer and the heavy gold layer are successively electroplated on the goldfinger, so that the time for electroplating the goldfinger is greatly shortened, the gold leakage caused by contacting with the electroplate liquid for a long time is avoided and therefore the problem of short circuit of the goldfinger caused by gold leakage is solved. In comparison with the prior art, the method disclosed by the invention has high efficiency and short time in electroplating the heavy goldfinger, effectively improves the production efficiency and ensures the quality of the product.

Description

Technical field: [0001] The invention belongs to the technical field of manufacturing printed circuit boards, and in particular relates to a method for making golden fingers by double electroplating. Background technique: [0002] The gold finger is used for the parts of computer graphics card, memory stick, USB interface and other related equipment in contact with other substrates. It has good wear resistance and low contact resistance, and can meet the requirements of multiple insertions. It is used in printed circuit boards. During the production process, all card boards need electroplated gold fingers. [0003] At present, the process of making gold fingers on printed circuit boards is as follows: pre-process → copper immersion → board electricity → outer layer pattern transfer → pattern electroplating → alkaline etching → AOI inspection → silk screen solder mask protection gold finger guide line → gold finger window pattern ( Use a dry film to protect the lines in the ...

Claims

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Application Information

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IPC IPC(8): H05K3/40H05K3/24
Inventor 李丰姜雪飞陈波欧值夫焦荣辉
Owner SHENZHEN SUNTAK MULTILAYER PCB
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