Heat sink for LED (light-emitting diode) lamp holder
A technology of LED lamp holder and radiator, which is applied in lighting and heating equipment, semiconductor devices of light-emitting elements, cooling/heating device of lighting device, etc. Service life, the effect of avoiding fire
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Embodiment 1
[0017] Example 1, such as figure 2 As shown, a radiator for an LED lamp holder, the radiator is provided with a metal heat dissipation substrate 1, as a preferred embodiment, one side of the substrate 1 is the installation surface 11 of the LED lamp holder, in order to facilitate the installation and fixing of the LED lamp, on the installation surface 11 Mounting holes 15 are provided on the top; the other side of the substrate 1 is a heat dissipation surface 12, and the heat dissipation surface 12 is provided with graphite heat dissipation fins 2. When graphite is heated, it has a good heat radiation effect, and the substrate 1 is provided on the upper heat dissipation surface 12. There are connection holes 16 for pressing the graphite heat dissipation fins 2, so as to be used for connection when pressing the graphite heat dissipation fins 2, so that the two are firmly connected and not easy to separate.
Embodiment 2
[0018] Example 2, such as image 3 As shown, in this embodiment, the heat dissipation surface 12 of the heat dissipation substrate 1 is provided with a "T"-shaped raised heat dissipation part 13, and the graphite heat dissipation fins 2 are arranged on the raised heat dissipation part 13, and a "T" is set In this embodiment, the heat dissipation substrate 1 is provided with a hollow cavity 14, and the hollow cavity 14 is filled with a heat dissipation liquid 3, and the heat dissipation substrate 1 forms a heat dissipation conduit , the liquid in the heat dissipation pipe can form strong convection in addition to direct heat conduction when heated, and can quickly transfer the heat generated by the circuit chip to the heat dissipation fin 2 made of graphite, and through the graphite heat dissipation fin 2 Heat can be transferred over a large area through convection and heat radiation. The upper heat dissipation surface 12 of the substrate 1 is provided with connection holes 16...
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