Method for preparing resin-base composite material thermal protection structure from modified resin by vapor deposition process
A technology of vapor deposition method and thermal protection structure, which is applied to epoxy resin coatings, devices for coating liquids on surfaces, coatings, etc. The effect of stable and controlled process, simple molding process and improved thermal protection efficiency
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specific Embodiment approach 1
[0008] Specific implementation mode 1: This implementation mode is a method for preparing a thermal protection structure of a resin-based composite material by a modified resin vapor deposition method, which is specifically completed according to the following steps:
[0009] 1. Surface treatment of resin-based composite material base material: use sandblasting method or 80# sandpaper to evenly polish the surface of resin-based composite material base material, then use acetone to clean 2 to 4 times, and then use ethyl acetate to clean and wash 2 to 4 times. Dry to constant weight to obtain the resin-based composite material base material after surface treatment; 2. Deploy modified resin: mix trifunctional epoxy resin, curing agent, modifier, Stir the accelerator and dispersant evenly, then add the diluent at a stirring speed of 40r / min to 80r / min, dilute to a viscosity of 19m 2 / s~25m 2 / s, the modified resin is obtained; 3. Spray deposition: add the modified resin obtained ...
specific Embodiment approach 2
[0014] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the base material of the resin-based composite material described in step 1 is polyester resin-based composite material, epoxy resin-based composite material, bismaleimide Amine resin-based composites, polyimide resin-based composites, or cyanate resin-based composites. Others are the same as the first embodiment.
specific Embodiment approach 3
[0015] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is: the curing agent described in step 2 is to adopt m-phenylenediamine and DDM curing agent to mix by mass ratio 1: (0.8~1.2) to make. Others are the same as those in Embodiment 1 or 2.
[0016] The DDM curing agent described in this embodiment is a commercially available mixture of 4,4-diaminodiphenylmethane with a mass fraction of 75% and polyphenylpolyaminomethane with a mass fraction of 25%.
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