Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Water-based solution automatic cleaning device applied to printing device with tin cream adhered to surface

A technology of solder paste printing and surface adhesion, which is applied in the field of automatic cleaning of water-based solutions, can solve problems such as resource depletion, odor inhalation damage, and increased production costs, so as to improve product qualification rate, reduce pollutants, and reduce manufacturing costs. Effect

Inactive Publication Date: 2012-09-19
华晴国际有限公司
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In fact, in order to reduce the cost of steel plate cleaning, some surface adhesive manufacturers not only use ethanol (industrial alcohol) to clean steel plates, but even use recycled solvents as detergents. However, these basic cost reduction methods cannot avoid oil price increases. The increase in the cost of detergents brought about by the price, and the possible VOC (volatile organic compound) air pollution tax (about 12 yuan / kg), will eventually increase the cost of steel plate cleaning
[0009] Petroleum-based organic mixed solvents, in addition to their flammability, have a certain inhalation hazard, and will produce VOC (organic compounds) when they evaporate. These organic mixed solvents are also used in the petroleum refining process. For petrochemical derivatives, when international crude oil is used in large quantities, the exhaustion of resources will be accelerated. At this time, the price of crude oil will be unattainable, and users will increase production costs

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Water-based solution automatic cleaning device applied to printing device with tin cream adhered to surface
  • Water-based solution automatic cleaning device applied to printing device with tin cream adhered to surface
  • Water-based solution automatic cleaning device applied to printing device with tin cream adhered to surface

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] Please also see figure 1 and figure 2 , the water-based solution automatic cleaning method applied to the surface-adhesive solder paste printing device provided by the present invention mainly includes the following steps: storing 100% water-soluble cleaning solution that does not contain chlorinated solvents and brominated solvents in a solvent tank 11 agent 12; use a nozzle 13 to evenly spray the water-soluble cleaning agent 12 on a continuous one-way scrolling water-needle dust-free cloth 15 conveyed by a roller set 14; and use the water-needle dust-free cloth 15 to wipe clean The steel plate 16 of the solder paste printing device 10 is adhered to this surface.

[0029] The unused water needle clean cloth 15 is wound and stored in one side of the roller, and when the process of wiping the steel plate 16 is carried out, the water needle clean cloth 15 is continuously rolled in one direction by the roller group 14, so that the already The water-needle dust-free clot...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a water-based solution automatic cleaning device applied to a printing device with tin cream adhered to the surface. The method includes the following steps: using and storing 100% water-solubility cleaning agent free of chlorinated solvents and brominated solvents; evenly spraying the water-solubility cleaning agent on continuously-fed hydro-acupuncture non-dust cloth; and using the hydro-acupuncture non-dust cloth to wipe and clean a steel plate of the printing device with tin cream adhered to the surface.

Description

technical field [0001] The invention relates to a surface-adhesive solder paste printing device, in particular to a water-based solution automatic cleaning method applied to the device. Background technique [0002] Surface mount technology (SMT) refers to the direct soldering of packaged electronic components to the solder joints (PAD) on the surface of the printed substrate with solder paste. The implementation method of the printed circuit board (PCB) using surface mount components is called surface mount. Technology (SMT), the adhesion of this surface mount part to the printed circuit board is based on: applying solder paste to the land of the printed circuit board, and then mounting the parts that match the terminals of the surface mount part on the land After using the adhesive force of the solder paste to keep the parts on the substrate, the printed circuit board is heated by a reflow furnace to melt the solder paste, and the surface-mounted parts are soldered to the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B23K1/20B08B7/04
Inventor 刘富华
Owner 华晴国际有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com