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Counterpoint mark and method for using same to manufacture workpieces in exposure process

A technology of alignment marks and alignment marks, which is applied to microlithography exposure equipment, photoplate-making process on patterned surfaces, and originals for photomechanical processing, etc. It can solve problems such as the inability of alignment of exposure machines to achieve improved Yield rate and production efficiency, reduction of pre-alignment steps, and production cost savings

Inactive Publication Date: 2012-09-26
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] The technical problem to be solved by the present invention is to provide an alignment mark and a method for making a workpiece using the alignment mark in the exposure process for the above-mentioned deficiencies in the existing alignment method in the exposure process. The alignment mark can Effectively solve the problem that the exposure machine cannot be aligned due to the lack of alignment patterns or alignment marks in the exposure process of the prior art. Using this method to make workpieces can effectively improve the product yield while ensuring alignment accuracy. , but also increase production efficiency

Method used

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  • Counterpoint mark and method for using same to manufacture workpieces in exposure process
  • Counterpoint mark and method for using same to manufacture workpieces in exposure process
  • Counterpoint mark and method for using same to manufacture workpieces in exposure process

Examples

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Embodiment 1

[0043] In this embodiment, the manufactured workpiece is a semiconductor element, and the semiconductor element is specifically a TFT device, and the TFT device includes N-layer patterns, where N>2. The first layer pattern of the TFT is made by exposing the first mask by the exposure machine, and correspondingly, the other layers of the TFT are respectively made by exposing the i-th mask by the exposure machine, and the first mask The first alignment mark 7 is set on the i-th mask, and the i-th alignment mark 8 is set on the i-th mask. In this embodiment, the exposure machine is a scanning exposure machine.

[0044] Such as Figure 5 As shown, the first alignment mark 7 is set on the first mask. In this embodiment, the first alignment mark 7 includes a first sub-mark 11, a second sub-mark 12, a third sub-mark 13 and a fourth sub-mark The marks 14 , that is, the first sub-mark 11 , the second sub-mark 12 , the third sub-mark 13 and the fourth sub-mark 14 are all set on the fi...

Embodiment 2

[0062] The difference between this embodiment and Embodiment 1 lies in that the shape of the first alignment mark 7 in the first mask is different from that in Embodiment 1.

[0063] In this example, if Figure 9 As shown, the first sub-mark 11, the second sub-mark 12, the third sub-mark 13 and the shape of the fourth sub-mark 14 are all the same square, and its essence is to divide a square into four equal parts (each equal part The shape of the sub-mark is a square), and the shape of the spacing between the first sub-mark 11, the second sub-mark 12, the third sub-mark 13, and the fourth sub-mark 14 is a hollow cross, that is, a cross is used to divide the square.

[0064] In this embodiment, the shape of the i-th alignment mark 8 in the i-th mask is the same as that in the first embodiment.

[0065] The other structures of the alignment mark in this embodiment and the method of using the alignment mark to make a TFT in the exposure process are the same as those in Embodimen...

Embodiment 3

[0067] The difference between this embodiment and Embodiment 1 lies in that the shape of the first alignment mark 7 in the first mask is different from that of Embodiment 1.

[0068] In this example, if Figure 10 As shown, the first sub-mark 11, the shapes of the second sub-mark 12, the third sub-mark 13 and the fourth sub-mark 14 are all the same sector, which is essentially a circle divided into four equal parts (each equal part The shape of the sub-mark is a fan), and the shape of the spacing between the first sub-mark 11, the second sub-mark 12, the third sub-mark 13, and the fourth sub-mark 14 is a hollow cross, that is, the cross divides the circle .

[0069] In this embodiment, the shape of the i-th alignment mark 8 in the i-th mask is the same as that in the first embodiment.

[0070] The other structures of the alignment mark in this embodiment and the method of using the alignment mark to make a TFT in the exposure process are the same as those in Embodiment 1, an...

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Abstract

The invention provides a counterpoint mark, which comprises N counterpoint mark bodies. The N counterpoint mark bodies are respectively arranged on N mask plates, a first counterpoint mark body comprises a first secondary mark and a second secondary mark, and the first secondary mark and the second secondary mark are arranged on a first mask plate and are centrosymmetric about a point on the first mask plate; except for the counterpoint mark body on the first mask plate, the shapes of the counterpoint mark bodies on other mask plates are the same or similar, the ith counterpoint mark body on the ith mask plate comprises a fifth secondary mark and a sixth secondary mark, both the fifth secondary mark and the sixth secondary mark are strip-shaped and are perpendicularly crossed to form a cross, and the width of the fifth secondary mark and the width of the sixth secondary mark are proper so that the fifth secondary mark and the sixth secondary mark can penetrate through a gap between the first secondary mark and the second secondary mark and are not overlapped with the first secondary mark and the second secondary mark. The counterpoint mark can effectively solve the problem that in an exposure process in the prior art, an exposure machine cannot realize counterpoint due to loss of counterpoint graphs or counterpoint marks.

Description

technical field [0001] The invention relates to an alignment mark and a method for manufacturing workpieces using the alignment mark in an exposure process, and the alignment mark is especially suitable for the manufacture of semiconductor elements. Background technique [0002] Currently, commonly used flat panel displays include LCD (Liquid Crystal Display: Liquid Crystal Display) and OLED (Organic Light-Emitting Diode: Organic Light-Emitting Diode) displays. In the imaging process, each liquid crystal pixel in the LCD is driven by a thin film transistor (Thin Film Transistor: TFT for short) integrated on the array substrate (Array), and then cooperates with the peripheral driving circuit to realize image display; AMOLED (Active Matrix Organic Light Emission Display (Active Matrix Driven OLED) display uses TFT to drive the corresponding OLED pixels in the OLED panel, and then cooperates with the peripheral drive circuit to realize image display. In the above-mentioned dis...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F9/00G03F1/42G03F7/20
CPCG03F7/20G03F9/00G03F1/42G03F9/7076
Inventor 于航
Owner BOE TECH GRP CO LTD
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