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Packaging structure and packaging method of oled devices

A packaging structure and device technology, applied in the field of devices, can solve the problems of reduced packaging efficiency, package cover slippage and offset, and packaging accuracy cannot be guaranteed, so as to improve packaging efficiency, avoid slippage and offset, and adapt The effect of large-scale promotion

Active Publication Date: 2015-08-19
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the mating surfaces of the package cover and the display substrate are both flat, this package structure often causes the package cover to slip and shift due to uneven force during the packaging process, resulting in that the packaging accuracy cannot be guaranteed, and workers spend a long time tuning results in a greatly reduced package efficiency

Method used

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  • Packaging structure and packaging method of oled devices
  • Packaging structure and packaging method of oled devices
  • Packaging structure and packaging method of oled devices

Examples

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Embodiment Construction

[0027] Such as figure 1 As shown, the packaging structure of the OLED device of the present invention includes a display substrate 2 for supporting the OLED device 1, a packaging cover plate 3 that is combined with the display substrate 2 and seals the OLED device 1, and bonded to the packaging cover plate 3. A packaging pressing device 4 for pressing the packaging cover plate 3 and the display substrate 2 . A first engaging portion is provided on the supporting joint surface of the display substrate 2 , and a second engaging portion matched with the first engaging portion is provided on the packaging joint surface of the package cover 3 combined with the supporting joint surface.

[0028] combine figure 2 As shown, the first surface 21 of the rectangular display substrate 2 serves as a supporting joint surface for supporting the OLED device 1 and combining with the package cover 3 . The OLED device 1 is bonded to a specific position approximately in the center of the first...

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Abstract

The invention provides a package structure for an organic light emitting diode (OLED) device. The structure comprises a display substrate which is used for bearing the OLED device, and a package cover plate which is combined with the display substrate and seals the OLED device, wherein a first clamp part is arranged on the bearing combination surface of the display substrate; and a second clamp part which is matched with the first clamp part is arranged on the package combination surface, combined with the bearing combination surface, of the package cover plate. Due to the existence of the first clamp part and the second clamp part, the package cover plate and the display plate of the package structure for the OLED device can be jointed after being aligned precisely. By using the package structure of the OLED device provided by the invention, the slipping and the deviation of the package cover plate caused by the non-uniform stress in a package process are avoided effectively, the package precision is ensured effectively, and the package structure is suitable for large-scale popularization. The invention also provides a package method for the OLED device. By the package method provided by the invention, the package precision is effectively ensured and the package efficiency is greatly improved; and therefore, the package method provided by the invention has high operability and is suitable for large-scale popularization.

Description

technical field [0001] The invention relates to a device composed of multiple semiconductors or other solid components in a common substrate, in particular to a packaging structure and packaging method of an OLED device. Background technique [0002] An organic electroluminescent device, also known as an organic light emitting diode (Organic Light Emitting Diode, OLED), is a new type of flat panel display device. Its light-emitting mechanism is: holes injected from the anode and electrons injected from the cathode are transported towards each other under the action of an electric field, forming excitons when they meet in the light-emitting layer, and releasing energy in the form of photons when the excitons return from the excited state to the ground state. Compared with liquid crystal display devices, OLED has many advantages such as active light emission, low driving voltage, high brightness and efficiency, high contrast, ultra-thin, low power consumption, wide viewing ang...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L51/56
Inventor 王玉林
Owner BOE TECH GRP CO LTD
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