Method of manufacturing circuit board with metal base, and circuit board with metal base

Abstract

Disclosed is a method of manufacturing a circuit board with metal base, wherein heat dissipation characteristic thereof is enhanced by mounting electronic parts directly onto the metal base, enabling inexpensive processing and alleviating generation of flaws, while allowing further development in high-density mounting. The method of manufacturing a circuit board with metal base is provided with: a protrusion-section forming process (S1) wherein a punch (16) is driven in from a second side-face of the metal base (3) to a depth halfway through in the thickness direction thereof, forming by half-blanking, on a first side-face of the metal base (3), a protrusion section (23) that is pushed into a hole (17) of a die (19) and has a cross section at the front tip circumference section (23a) thereof to be a curved shape, and punching out portions of an insulation layer (5) and a dummy copper foil pattern (21) at a place where the dummy copper foil pattern (21) exists; a peeling off process (S2) wherein the front tip of the protrusion section (23) is exposed by peeling off the punched-out refuse (27) that were portions of the insulation layer (5) and dummy copper foil pattern (21) that were punched out, utilizing the curved shape of the protrusion section (23); and a mounting section forming process (S3) wherein the protrusion section (23) is press molded to form an electronic-part mounting section (9).

Description

technical field [0001] The present invention relates to a method for manufacturing a metal base circuit board on which electronic devices such as LEDs (light emitting diodes) are mounted, and the metal base circuit board. Background technique [0002] In recent years, electronic devices such as LEDs (Light Emitting Diodes) have been used in a wide range of fields due to their convenience, and metal base circuit boards have been used to improve heat dissipation. [0003] The above-mentioned metal base circuit board uses a metal base made of aluminum or an aluminum alloy, and a circuit is formed on the metal base with a metal foil such as copper foil through an insulating layer. The electronic device adopts a structure connected to the above-mentioned circuit by wire bonding, soldering, or the like. [0004] Therefore, heat generated by electronic devices can be dissipated through the metal base with high thermal conductivity, enabling high-density mounting. [0005] However...

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Problems solved by technology

[0007] However, machining or laser processing will cause problems such as higher processing costs and damage

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