Flip chip packaging method

A technology of flip-chip packaging and chips, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as insufficient peel strength and poor coating, so as to avoid insufficient peel strength, shorten sealing time, and improve sealing performance. The effect of glue efficiency

Active Publication Date: 2012-10-17
CHIPMORE TECH CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] In order to solve the above technical problems, the present invention provides a flip-chip packaging method, which solves the problems of the prior art by changing the glue application path, saves the time for sealing glue, improves the sealing efficiency, and avoids the problem to a certain extent. Air bubbles, poor coating and insufficient peel strength in the sealing area are eliminated

Method used

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Embodiment 1

[0056] The specific process of the flip-chip packaging method disclosed in the embodiment of the present invention is as follows: figure 2 As shown, specifically, after the bumps of the chip IC are bonded to the pins of the circuit substrate, glue is applied around the chip, wherein the sequence of glue application is clockwise or counterclockwise along the circumference of the chip, and At least one side of the first long side of the chip is first coated with an adhesive material, and after the adhesive material seeps out from the bottom of the chip, the adhesive material is coated on the side of the second long side of the chip.

[0057] It should be noted that in this embodiment, as long as glue is applied around the chip in a clockwise or counterclockwise direction, the specific sequence of glue application is not limited, and glue can be applied from any position on the circumference of the chip, such as Glue can be applied from the short side of the chip, or from the lo...

Embodiment 2

[0067] The specific process of the flip-chip packaging method disclosed in this embodiment is as follows: Figure 4 and Figure 5 as shown, Figure 4 Schematic diagram of the gluing path for the method, Figure 4 Each label in indicates the glue application direction and path, Figure 5 It is a schematic diagram of each coordinate point for determining the moving direction of the dispensing needle during the glue application process, Figure 5 The marks (1)-(10) in the figure represent each coordinate point, and the position of each coordinate point determines the moving direction of the dispensing needle.

[0068] It should be noted that, in general, the first long side coated in the glue coating process is the output terminal output of the chip, and the second long side is the input terminal input terminal of the chip, because there are often more pins at the output terminal of the chip. There are fewer pins at the input end, and the glue is applied from the output end w...

Embodiment 3

[0085] The specific process of the flip-chip packaging method disclosed in this embodiment is as follows: Figure 7 and Figure 8 As shown, similar to the previous embodiment, Figure 7 Schematic diagram of the gluing path for the method, Figure 7 Each label in indicates the glue application direction and path, Figure 8 It is a schematic diagram of each coordinate point for determining the moving direction of the dispensing needle during the glue application process, Figure 8 The reference numerals (1)-(11) in represent respective coordinate points.

[0086] In this embodiment, glue application from the output end of the chip is still taken as an example, that is, the long side on the left side of the chip in the figure is the output end of the chip, and the long side on the right side is the input end of the chip, and the points used in this embodiment The distance between the glue needle and the glue application path and the four sides of the chip is also similar to t...

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Abstract

The embodiment of the invention discloses a flip chip packaging method, comprising: bonding bumps of a chip with leads of a circuit substrate; and then carrying out glue coating around the chip. More specifically, the glue coating sequence is as follows: the glue coating is carried out along a clockwise direction or an anticlockwise direction of the perimeter of the chip; and at least a glue material is coated at one side of a first long edge of the chip firstly; and after the glue material oozes from the chip below, the glue material is coated at one side of a second long edge of the chip. According to the flip chip packaging method disclosed by the embodiment of the invention, the glue material is coated around the chip and the glue coating mode is controlled, so that defects of bubble occurrence, poor cladding performance and insufficient peeling strength and the like can be basically overcome. Moreover, because the glue material is coated among the bumps, the occurrence of short circuits among the bumps can be avoided. And meanwhile, the utilization of the mode of glue coating around the chip enables glue sealing efficiency to be enhanced to some extent; and it is unnecessary to wait for penetration of the glue material to the other side of the chip, thereby saving lots of time and thus shortening the glue sealing time.

Description

technical field [0001] The invention relates to integrated circuit packaging technology, in particular to a flip-chip packaging method. Background technique [0002] With the increase in the density of integrated circuits, the packaging technology of chips is becoming more and more diversified. Due to the advantages of reducing the size of chip packaging and shortening the signal transmission path, Flip Chip Interconnect Technology (FC) has been widely used. Applied in the field of chip packaging, such as chip size packaging, chip direct attachment packaging and multi-chip module packaging, etc., can benefit the flip-chip packaging technology to achieve the purpose of packaging chips. [0003] The flip-chip packaging technology is to bond the bare die (bar die) to the substrate in a face-down manner. The specific process is to set a plurality of soldering pads on the surface of the chip, and form bumps on the soldering pads, then turn the chip over, and use technologies suc...

Claims

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Application Information

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IPC IPC(8): H01L21/56
Inventor 王东宋玲
Owner CHIPMORE TECH CORP LTD
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