Dust removing device for laser stamping of flexible circuit board

Abstract

The embodiment of the invention discloses a dust removing device for the laser stamping of a flexible circuit board. Except that the dust removing device is provided with an air exhausting plate, the dust removing device is also provided with a first air blowing plate. When the dust removing device works, a stronger positive air pressure area is formed at the periphery of an outer pin area of a flexible circuit board, which is arranged below a first air blowing hole, so that pollutants generated in the laser marking process, especially silicon dust, can not reach the outer pin area. Meanwhile, a very strong negative air pressure area is formed at an area between an air exhausting hole and the surface of the flexible circuit board. In this way, high-speed airflow flowing from the positive air pressure area to the negative air pressure area is formed, so that pollutants attached to the flexible circuit board and the pollutants generated during laser marking can be quickly discharged out of a machine platform by the air exhausting hole. According to statistics, the clearance rate of the pollutants is about 98 percent. Therefore, the pollutants generated in the laser marking process can be better removed by adopting the dust removing device for the laser stamping of the flexible circuit board in the embodiment of the invention.

Description

technical field [0001] The invention relates to the field of circuit board processing equipment, and more specifically relates to a laser marking dust removal device for flexible circuit boards. Background technique [0002] Flexible and Rigid-Flex Printed Circuit (FPC for short) is a printed circuit board made of polyimide or polyester film as the base material, including the base material, the silicon chip arranged on the base material and forming an integrated circuit chip and the pins connected to the silicon chip. In the process of making flexible circuit boards, the silicon wafers are all provided with a logo representing its model, which is printed by ink stamping technology. Since the raw material of the ink imprinting machine is ink, and its structure is relatively complicated. Therefore, its printing speed is relatively slow, the printed characters are not clear, and the printed logo is easy to be removed, which affects the recognition of the type of silicon chip...

AI Technical Summary

Problems solved by technology

Since the diameter of the above-mentioned marking hole is relatively large, and the dust removal device only forms a negative pressure through the pumping action, the negative pressure and airflow generated in the space between the dust removal device and the flexible circuit board are small, and remain on the surface of the flexible circuit board. Pollutants cannot be removed well

The pollutants cannot be removed in time. On the one hand, the pollutants adhere to the surface of the flexible circuit board, especially the outer pins of the flexible circuit board, which can easily cause a short circuit of the flexible circuit board; on the other hand, the pollutants pass through the laser head of the laser marking machine. The caliber of the focusing mirror pollutes the focusing mirror of the laser head located directly above the flexible circuit board, and the fonts printed by the focusing mirror of the laser head will appear hyphenated and deformed, which will affect the recognition of the printed logo

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