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Micro-nano processing method and device

A micro-nano processing and pre-processing technology, applied in the direction of electrolysis process, electrolysis components, etc.

Active Publication Date: 2012-11-07
CHONGQING INST OF GREEN & INTELLIGENT TECH CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In view of this, the present invention provides a micro-nano processing method and equipment to overcome the problems in the prior art that it is impossible to achieve low cost, high efficiency, and high-definition in the process of performing micro-nano processing

Method used

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  • Micro-nano processing method and device

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Experimental program
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Embodiment 1

[0054] like figure 1 As shown, it is a schematic diagram of the principle of the electrochemical processing method of the micro-nano structure to control the distribution of the electrostatic field, where 1 is the electrode plate, 2 is the substrate to be processed, 3 is the micro-nano structure to be prepared, and 4 is the virtual electrostatic field on the substrate Nearby intensity distribution, 5 is the color scale of the electric field intensity, the darker the color, the stronger the field strength, 6 is the contour curve of the field intensity on a plane near the surface of the substrate to be processed (at the position of the dotted line), 7 is the electrochemical solution carriers in .

[0055] Based on the above structure, such as figure 2 As shown, it is a flowchart of a micro-nano processing method disclosed in the embodiment of the present invention, which mainly includes the following steps:

[0056] Step S101, obtaining various parameters of the substrate to ...

Embodiment 2

[0095] like Figure 5 As shown, it is a schematic structural diagram of a micro-nano processing device disclosed in this embodiment of the present invention, which mainly includes: an electrode plate 1 , a substrate 2 , an electrochemical solution 8 , a solution tank 9 , a stirring device 10 and a current source 11 .

[0096] The substrate 2 is a substrate to be micro-nano processed.

[0097] The electrode plate 1 is based on various parameters of the substrate 2 to be micro-nano processed, and the electric field distribution mode on the surface of the conductor determine the structure;

[0098] Wherein, each parameter includes the substrate shape, size, conductivity, pre-processed micro-nano structure index of the substrate 2, and the electric field strength E of the electrostatic field on each part of the substrate surface, and n is the normal component or diameter of the electrostatic field. to the component, H is the average radius of curvature of the electrostatic fiel...

Embodiment 3

[0105] Based on the micro-nano processing method disclosed in the first embodiment and the micro-nano processing device disclosed in the second embodiment. Since there are many kinds of micro-nano structure materials to be processed, this embodiment gives a specific example. In this embodiment, only depositing copper micro-nano structure graphics on a flat gold substrate is taken as an example. In addition, it should be noted that the production of micro-nano structures of other materials, by replacing the electrochemical solution and the electrode plate, according to the following specific operation methods, The same can be achieved.

[0106] The micro-nano processing based on this embodiment of the present invention is as Figure 5 As shown, wherein, the micro-nano structure 3 to be prepared is a deposited copper micro-nano structure, the electrochemical solution 8 is a copper plating solution, an electrode plate 1, a substrate 2, a solution tank 9, a stirring device 10 and...

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Abstract

The invention discloses a micro-nano processing method and a device. All parameters of a substrate to be processed are utilized, the structure of an electrode plate is determined according to the distribution mode of a conductor surface electric field; an electrochemical solution is determined according to the structure of the electrode plate and indexes of a pre-processing micro-nano structure on the substrate to be processed; the electrode plate and the substrate connected with the anode or the cathode of a current source respectively are placed in the electrochemical solution in an opposite mode, after the power is on, the electrochemical solution is stirred in a preset time, and the micro-nano structure on the substrate and in accordance with the preset indexes is manufactured by using current carriers in the electrochemical solution. According to the micro-nano processing method and the device, reaction ions in the electrochemical solution are controlled by controlling the distribution of the electrostatic field on the surface of the substrate to be subjected to the micro-nano processing, and the micro-nano structure with certain surface shape distribution is manufactured on the substrate finally. Accordingly, purposes of low cost, high efficiency and high precision of processing of a three dimensional and curved surface structure are achieved through the operation of the electrostatic field.

Description

technical field [0001] The invention relates to the technical field of micro-nano processing, and more specifically, relates to a method and equipment for micro-nano processing based on controlling the distribution of an electrostatic field. Background technique [0002] For micro-nano structures that are widely used in the fields of micro-nano optoelectronics, semiconductors, micro-machines, biochips, micro-nano biological detection, etc., the mainstream micro-nano processing technologies mainly include traditional lithography technology, various beam writing technologies and nanopress printing technology, etc. [0003] Using photolithography technology for micro-nano processing can efficiently realize the batch preparation of micro-nano structure patterns. However, this lithography technology is powerless in preparing 3D patterns with high surface precision. At the same time, in order to prevent adverse effects such as virtual edges of the graphics caused by the diffract...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/00C25F3/00C25F7/00
Inventor 张为国史浩飞董小春夏良平杜春雷
Owner CHONGQING INST OF GREEN & INTELLIGENT TECH CHINESE ACADEMY OF SCI
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