Work bench of laser cutting ceramic circuit substrate

Abstract

The invention provides a work bench of a laser cutting ceramic circuit substrate. The work bench is a combined unit of an upper structure and a lower structure and is composed of a fixed base and a flexible connecting mobile station; the fixed base is a hollow columnar cylinder body; the bottom end of the fixed base is sealed; the cylinder body is radially provided with a vacuum port air nozzle (7) which is connected with a vacuum apparatus; the flexible connecting mobile station is located above the fixed base (6) and is an annular plate with a radial outer edge, and is axially provided with a locating annular base (2) with a conical lug boss and a locking ring (1) which is coaxially fitted on a conical surface of the conical lug boss; circular ring steps, which are gradually amplified along an inner wall conical surface, are arranged on a conical hole surface of an inner cavity of the locating ring base; a wire mesh for supporting and locating the drilling ceramic substrate to be cut is tightened on an annular end plane of a central hole of the locating ring base (2); clamping and tightening are accomplished through a conical degree fitting surface between the locking ring and the locking ring base. According to the work bench, the problems that the laser cutting drilling ceramic circuit board is always hard to clean and needs to re-condense Al2O3 ceramic nodule are solved.

Description

technical field [0001] The present invention relates to a CO 2 Laser cut / drilled Al 2 o 3 Workbench for ceramic circuit board substrates. Background technique [0002] At present, laser cutting is used to process Al 2 o 3 The way of cutting ceramic circuit substrates is not common, the main reason is that the recondensation of Al on the processing surface 2 o 3 The pollution of ceramics cannot be solved well. Although CO 2 The laser machine draws the laser beam from the compressed gas nozzle, which improves the gasification of Al 2 o 3 The blow-off efficiency of ceramics reduces the occurrence of carbon deposits and tumor deposits on the cutting surface, but if the blow-off airflow forms a reflection, recondensation of Al 2 o 3 Ceramic contamination is inevitable and very difficult to remove. The processing height is above 20mm, and the overhead processing surface can solve the problem, but the ceramic parts are extremely thin. If there is no object support, the ...

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Problems solved by technology

[0004] The present invention aims at the problems existing in the above-mentioned prior art, and provides a simple, convenient, high-efficiency, stable and reliable processing quality, adopts laser cutting to process ceramic substrate plates, and does not form condensed Al on the processing surface. 2 o 3 Cutting and processing ceramic circuit substrate drilling workbench for ceramic oncolysis, to solve the CO 2 Laser Cut Drilled Al 2 o 3 Surface Oncolytic Contamination of Ceramic Circuit Boards

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