Organic silicon light-cured packaging glue used for LED packaging and application

A technology of LED encapsulation and light curing, which is applied in the direction of adhesives, adhesive types, polyether adhesives, etc., can solve the problems of poor reliability, low efficiency, and low light output rate of products, and achieve good adhesion and sealing and curing speed Fast, the effect of improving the light output rate

Active Publication Date: 2014-01-29
SHENZHEN COSLED LIGHTING
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In summary, the purpose of the present invention is to solve the technical problems of low efficiency, low product light yield and poor reliability in the existing production method of LED light source components, and propose a kind of organic silicon photocurable encapsulant for LED encapsulation and its application

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  • Organic silicon light-cured packaging glue used for LED packaging and application

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Embodiment Construction

[0031] The organic silicon photocurable encapsulant for LED packaging proposed by the present invention includes photocurable silicone resin, methoxy polyethylene glycol monoacrylate, polyether modified organosiloxane, silicon dioxide modified silicone alkanes, 2-hydroxy-2-methyl-1-phenylacetone, 1-hydroxy-cyclohexylbenzophenone, urethane monoacrylate, hexanediol acrylate and phenol. The weight percentage of each substance is: 40-80% of photocurable silicone resin, 20-40% of methoxy polyethylene glycol monoacrylate, 0.5-1.5% of polyether modified organosiloxane, and 0.5-1.5% of polyether modified silicone Alkanes 0.3-0.9%, 2-hydroxy-2-methyl-1-phenylacetone 1-6%, 1-hydroxy-cyclohexylbenzophenone 1-6%, urethane monoacrylate 1-5% , Hexylene glycol acrylate 0.3-2.0%, phenol 0.01-1%. Among them, photocurable silicone resin is the main photocurable silicone resin, which is the main photocurable film-forming substance; methoxy polyethylene glycol monoacrylate is used as photocurabl...

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Abstract

The invention relates to an organic silicon light-cured packaging glue used for LED packaging and an application, which relates to the LED light source components packaging technical field. The organic silicon light-cured packaging glue used for LED packaging solves the technical problems of low existence efficiency, low product light extraction rate and poor reliability of the production methods of the current LED light source components, and comprises the following components of light-cured silicone resin, methoxy polyethylene glycol acrylic acid ester, polyether modified organo-silicone, silica modified siloxane, 2-hydroxy-2methyl-phenylacetone-1,1-hydroxy-cyclohexyl phenyl ketone, carbamate acrylic acid ester, hexanediol acrylic acid ester and phenol. The organic silicon light-cured packaging glue has the advantages that solidification speed is fast, the cure shrinkage is low, the adhesion sealing performance is good, the phosphor settlement phenomenon is effectively prevented, the phenomenon of being diffused after dispensing can be avoided, operations like boring and polishing on the metal plates are not required, an insulating layer and a mirror surface of the sheet metal are bonded, a cofferdam is formed on the hole wall of a lamp cup aperture on the insulating layer, seal glue diffusion can be prevented, the seal glue amount can be saved, the light extraction rate is increased, folding or bending of the electrode of an LED wafer is not required, and the product reliability can be enhanced.

Description

technical field [0001] The invention relates to the technical field of packaging of LED light source components. Background technique [0002] At present, due to the good fluidity of the existing LED encapsulants, during the curing process, the phosphor powder added to the encapsulant, even if it is evenly prepared under the action of its own gravity, will still settle after curing, and it will be close to the LED chip. The color temperature value of LED light, the larger the phosphor particles, the more obvious the sedimentation, the closer to the LED chip, the higher the temperature, accelerated aging, and reduced the service life of the LED lamp; in addition, due to the fluidity of the existing LED packaging glue, the existing Technology Before sealing the LED chip with glue, to avoid the spread of the glue, it is necessary to make the lamp cup groove or cofferdam first. The method of making the cup groove or cofferdam is first to drill several lamp cup grooves on the alu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/04C09J171/00C09J11/06H01L33/56H01L33/48
Inventor 何忠亮荆忠
Owner SHENZHEN COSLED LIGHTING
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