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Universal power semiconductor module fixture

A technology for power semiconductors and fixtures, which is used in the testing of single semiconductor devices, measuring device casings, etc., can solve problems such as poor versatility, achieve accurate thermal resistance test results, improve versatility and ease of use, and prevent horizontal movement.

Inactive Publication Date: 2012-11-21
INST OF ELECTRICAL ENG CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the shortcoming of poor versatility in the prior art, and propose a universal fixture for power semiconductor modules

Method used

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  • Universal power semiconductor module fixture
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  • Universal power semiconductor module fixture

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] This embodiment is suitable for testing using an independent liquid cold plate.

[0032] like figure 2 As shown, the liquid cooling plate 5 is placed on the bottom plate 11 , and the bottom surface of the power semiconductor module 2 to be tested is coated with thermal conductive silicone grease, and placed on the liquid cooling plate 5 . Slide the position of the slide rail group 3, and then adjust the position of the slider group 4 to ensure that the fastening bolt 43 is perpendicular to the mounting hole 21 of the power semiconductor module 2 to be tested. Turn the fastening bolt 43 so that the fastening bolt 43 moves downward perpendicular to the power semiconductor module 2 to be tested, and the tapered end 44 of the fastening bolt 43 enters the mounting hole 21 of the semiconductor power module 2 to be tested. Design, its maximum diameter is larger than the diameter of the installation hole 21, and the minimum diameter is smaller than the diameter of the install...

Embodiment 2

[0036] This embodiment is applicable to a test in which a liquid channel is directly integrated on the bottom plate of the fixture without using an independent liquid cooling plate.

[0037] like Figure 4As shown, the power semiconductor module 2 under test whose bottom surface is coated with thermal conductive silicone grease is placed on the bottom plate 110 integrated with the liquid channel. Slide the position of the slide rail group 3, and then adjust the position of the slider group 4 to ensure that the fastening bolt 43 is perpendicular to the mounting hole 21 of the power semiconductor module 2 to be tested. Turn the fastening bolt 43 so that the fastening bolt 43 moves downward perpendicular to the power semiconductor module 2 to be tested, and the tapered end 44 of the fastening bolt 43 enters the mounting hole 21 of the semiconductor power module 2 to be tested. design, its maximum diameter is larger than the aperture of the mounting hole 21, and its minimum diame...

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Abstract

A universal power semiconductor module fixture comprises a pressure fixture capable of adjusting a pressing position and a height, and a heat sink. The pressure fixture comprises a pedestal (1), a sliding rail set (3) installed on the pedestal (1) and a sliding block set (4) installed on the sliding rail set (3). The heat sink is an independent liquid cooling plate (5) with a liquid passage; and the liquid cooling plate (5) is arranged on a bottom plate (11) of the pressure fixture, or is a bottom plate (110) of the pressure fixture, which is integrated with the liquid passage.

Description

technical field [0001] The invention relates to a general fixture, in particular to a fixture for thermal resistance testing of power semiconductor modules of different specifications. Background technique [0002] The thermal resistance of a power semiconductor module is an important indicator of its performance parameters, indicating the heat dissipation capability of the module. Thermal resistance is an important factor to consider in the design of the module structure. Accurate measurement of thermal resistance has important reference significance for improving module packaging and heat dissipation design. [0003] Currently, the latest JEDEC standard JESD-51-14 proposes a thermal resistance measurement method for semiconductor devices with a single heat dissipation path. Using this test method to test the power semiconductor module requires the module to be closely attached to the heat dissipation base plate and a certain pressing force is applied to ensure good conta...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/26G01R1/04
Inventor 仇志杰张瑾温旭辉
Owner INST OF ELECTRICAL ENG CHINESE ACAD OF SCI
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