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Electromagnetic-shielding film, flexible substrate formed using same, and process for producing same

A flexible substrate, electromagnetic wave technology, applied in the direction of magnetic/electric field shielding, crosstalk/noise/electromagnetic interference reduction (, conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problem of not obtaining electromagnetic wave shielding film, etc., to achieve The effect of excellent electromagnetic wave shielding effect

Active Publication Date: 2012-11-21
TATSUTA ELECTRICWIRE & CABLE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, the present situation is that an electromagnetic wave shielding film that maintains electromagnetic wave shielding properties even after bending or sliding hundreds of thousands of times has not yet been obtained.

Method used

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  • Electromagnetic-shielding film, flexible substrate formed using same, and process for producing same
  • Electromagnetic-shielding film, flexible substrate formed using same, and process for producing same
  • Electromagnetic-shielding film, flexible substrate formed using same, and process for producing same

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Embodiment

[0043] Examples of the present invention are shown below, but the present invention is not limited to the following examples.

[0044] [Example, comparative example]

[0045] A two-layer structure consisting of an epoxy-based soft layer and an acrylic hard-coat layer is formed by applying and drying an epoxy-based resin to a thickness of 6 μm on a release film, and applying and drying an acrylic hard-coat liquid on top of it. protective layer (described later figure 1 , 2 symbol in 1). On this protective layer, coat the conductive paste formulated by the proportion shown in table 1, 2, and form a conductive layer by drying (the same figure 1 , 2 Symbol 2 in ) to obtain an electromagnetic wave shielding film. The following evaluations were performed using the obtained electromagnetic wave shielding film. Details of the binder resin and metal powder used are as follows.

[0046] Binder resin: Dainichi Seika Co., Ltd., polyurethane resin UD1357

[0047] Metal powder: (a) ...

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Abstract

Provided is an electromagnetic-shielding film which, even when used in a part which frequently undergoes flexing or sliding, such as the hinge or the like of a cellphone, etc., retains the effect of shielding electromagnetic waves over a long period. Also provided is a process for producing a substrate, the process including using this film to form an electromagnetic-shielding layer. The electromagnetic-shielding film comprises a conductive layer comprising (A) metal particles and (B) a binder resin and a protective layer superposed on the conductive layer. The conductive layer is a layer formed from a conductive paste containing (a) flaky metal particles having an average thickness of 50-300 nm and an average diameter of 3-10 [mu]m and (b) acicular or dendritic metal particles having an average diameter of 3-10 [mu]m.

Description

technical field [0001] The present invention relates to an electromagnetic wave shielding film, a flexible substrate using the same, and a manufacturing method thereof. More specifically, it relates to an electromagnetic wave shielding film capable of maintaining an electromagnetic wave shielding effect even after sliding for a long period of time, a flexible substrate in which an electromagnetic wave shielding layer is formed using the film, and a manufacturing method thereof. Background technique [0002] Conventionally, electromagnetic wave shielding has been performed by laminating an electromagnetic wave shielding film on a flexible substrate (FPC) disposed on a hinge portion of a mobile phone or the like. As the electromagnetic wave shielding film, an electromagnetic wave shielding film having at least a conductive layer formed of a conductive adhesive (conductive paste) in which metal powder is dispersed in a binder resin and a protective layer is used. [0003] With...

Claims

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Application Information

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IPC IPC(8): H05K9/00H01B1/00H01B1/22
CPCH01B3/004H05K9/0083H01B1/22H05K1/0218H05K9/0009
Inventor 岩井靖柳善治登峠雅之
Owner TATSUTA ELECTRICWIRE & CABLE
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