277results about How to "Poor adhesion" patented technology

The present invention relates to an enhanced sequential or non-sequential atomic layer deposition (ALD) apparatus and technique suitable for deposition of barrier layers, adhesion layers, seed layers, low dielectric constant (low-k) films, high dielectric constant (high-k) films, and other conductive, semi-conductive, and non-conductive films. This is accomplished by 1) providing a non-thermal or non-pyrolytic means of triggering the deposition reaction; 2) providing a means of depositing a purer film of higher density at lower temperatures; 3) providing a faster and more efficient means of modulating the deposition sequence and hence the overall process rate resulting in an improved deposition method; and, 4) providing a means of improved radical generation and delivery. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. [37 C.F.R. § 1.72(b)].

The present invention relates to an enhanced non-sequential atomic layer deposition (ALD) technique suitable for deposition of barrier layers, adhesion layers, seed layers, low dielectric constant (low-k) films, high dielectric constant (high-k) films, and other conductive, semi-conductive, and non-conductive films. This is accomplished by 1) providing a non-thermal or non-pyrolytic means of triggering the deposition reaction; 2) providing a means of depositing a purer film of higher density at lower temperatures; and, 3) providing a faster and more efficient means of modulating the deposition sequence and hence the overall process rate resulting in an improved deposition method.

The present invention relates to an enhanced sequential atomic layer deposition (ALD) technique suitable for deposition of barrier layers, adhesion layers, seed layers, low dielectric constant (low-k) films, high dielectric constant (high-k) films, and other conductive, semi-conductive, and non-conductive films. This is accomplished by 1) providing a non-thermal or non-pyrolytic means of triggering the deposition reaction; 2) providing a means of depositing a purer film of higher density at lower temperatures; and, 3) providing a faster and more efficient means of modulating the deposition sequence and hence the overall process rate resulting in an improved deposition method.

Fine wirings are made by a method having the steps of painting a board with metal dispersion colloid including metal nanoparticles of 0.5 nm-200 nm diameters, drying the metal dispersion colloid into a metal-suspension film, irradiating the metal-suspension film with a laser beam of 300 nm-550 nm wavelengths, depicting arbitrary patterns on the film with the laser beam, aggregating metal nanoparticles into larger conductive grains, washing the laser-irradiated film, eliminating unirradiated metal nanoparticles, and forming metallic wiring patterns built by the conductive grains on the board. The present invention enables an inexpensive apparatus to form fine arbitrary wiring patterns on boards without expensive photomasks, resists, exposure apparatus and etching apparatus. The method can make wirings also on plastic boards or low-melting-point glass boards which have poor resistance against heat and chemicals.

A heat-conductive sheet comprising a cured or semi-cured binder wherein a carbon fiber is orientated in the direction of the thickness of the heat-conductive sheet. This heat-conductive sheet exhibits a high anisotropic heat conductivity along the direction of the thickness thereof to thereby enable efficiently releasing heat from a heating element such as a semiconductor element or semiconductor package. Moreover, the heat-conductive sheet is excellent in not only heat resistance, durability and mechanical strength but also adherence to the heating element.

A cover stock composed mainly of a heated mixture of a thermoplastic polyurethane elastomer and a polyolefin oligomer or polyolefin which has been modified with functional groups is suitable for the manufacture of golf balls. The cover made of the stock has improved scuff resistance.

Hot dip galvanized steel sheet excellent in shapeability and plateability comprised of high strength steel sheet according to the present invention can be provided containing, by mass % about, C: 0.05 to 0.25%, Si: 0.3 to 2.5%, Mn: 1.5 to 2.8%, P: 0.03% or less, S: 0.02% or less, Al: 0.005 to 0.5%, N: 0.0060% or less and the balance of Fe and unavoidable impurities. The exemplary steel sheet can have thereon a galvanized layer containing, e.g., about Al: 0.05 to 10 mass % and Fe: 0.05 to 3 mass % and the balance of Zn and unavoidable impurities. Such exemplary hot dip galvanized steel sheet can have oxides containing Si in an average content of about 0.6 to 10 mass % at the crystal grain boundaries and in the crystal grains at the sheet steel side 5 μm or less from the interface between the high strength steel sheet and the plating layer and by the presence of Fe—Zn alloy with an average grain size of about 0.5 to 3 μm at the plating side.

The present invention is directed to two component coating compositions that cure under ambient conditions and more particularly to those having low VOC (volatile organic content) that are suitable for use in automotive refinish and Original Equipment Manufacturing (OEM) applications. The coating composition includes crosslinkable and crosslinking components, wherein the crosslinkable component includes a low polydispersity, low molecular weight copolymer having on an average 2 to 25 functional groups, such as hydroxyl, carboxyl, acetoacetoxy, primary and secondary amine, and epoxy. The copolymer is polymerized from a monomer mixture that includes one or more non-functional acrylate monomers and one or more functional methacrylate monomers provided with the functional groups. The crosslinking component includes polyisocyanate, polyamine, ketimine, melamine, epoxy, polyacid or a combination thereof. The invention is also directed to coating produced from the coating composition.

This invention discloses novel antimicrobial materials comprising of nanocrystalline metal, metal oxide, and active oxygen species in a permeable structure. It also discloses the compositions of the inventive material enriched with different active oxygen species. The inventive material showed a strong antimicrobial ability over a wide spectrum of microbies. The average log-reduction value was eight within five minutes. The inventive materials can remain sterile in air over more than two months. The methods used to prepare this inventive material are disclosed.

A plastic film comprising a transparent plastic substrate, a primer layer and a functional layer in this order wherein a refractive index n_s of the substrate and a refractive index n_H of the functional layer satisfy the following formula (1): 0.03≦|n_s−n_H| and an average reflectance of light of from 540 to 550 nm in wavelength incidenting perpendicular onto a face of the film at an interface among the functional layer and the substrate is 0.02% or less.

The thermal management multi-layer film/sheet and hollow articles for the use with secondary battery, supercapacitor and battery pack as thermal management casings or sleeves achieve effective control of the temperature of the operating batteries/supercapacitors. The thermal management multi-layer film/sheet and hollow article structure comprises a laminate of a plurality of alternative metal, plastic, and adhesive layers. And the plastic and adhesive layers comprise of parent phase resin, heat conductive particles, and microencapsule-phase-change-material (MCPCM). The heat conductive particles enhances the thermal conductivity, the MCPCMs absorb heat while the batteries/supercapacitors are in discharging mode.

A flexible and highly reliable liquid crystal display device which is not easily damaged even if subjected to external pressure is provided. A method for manufacturing, with high yield, a flexible and highly reliable liquid crystal display device which is not easily damaged even if subjected to external pressure is also provided. A liquid crystal display device including a first structure body including a first fibrous body and a first organic resin, a second structure body including a second fibrous body and a second organic resin, a liquid crystal interposed between the first and second structure bodies, and a seal member for fixing the first and second structure bodies and for enclosing the liquid crystal. The first and second fibrous bodies are impregnated with the first and second organic resins, respectively, and the first structure body and the second structure body are in contact with each other.

A light controlling film comprises a light reflecting film and a light controlling layer that are laminated. The light reflecting film comprises at least two laminated light reflecting layers including at least one of light reflecting layers PRL-1 to PRL-3 that a central reflection wavelength of 400 nm-500 nm, 500 nm-600 nm, and 600 nm-700 nm, respectively, and a reflectance to ordinary light at the central reflection wavelength of 5%-25%. The at least two light reflecting layers have central reflection wavelengths that are different from each other. All of the at least two laminated light reflecting layers have a property of reflecting polarized light having the same orientation. The light controlling layer comprises two quarter wave plates, and the light reflecting film is laminated so as to be interposed between the two quarter wave plates.

An integrated circuit device (300) includes a functional integrated circuit (IC) die (310) having a top IC surface with IC non-contact regions (313) and a plurality of electrically conductive bump pads (311, 312, 313) at pad locations. In the IC (310), at least one of the bump pads (311, 312, 313) extends outward from beyond the IC non-contact regions (313). The integrated circuit device (300) can also include a workpiece (305) having a top workpiece surface comprising at least one die attach area (319) for attaching the IC die (310). The die attach area (319) can include non-contact regions (316) and a plurality of electrically conductive contact pads (317) recessed relative to the non-contact regions (316), where the contact pads (317) face the top IC surface and match the pad locations (312). In the die attach area (319), at least one of the contact pads (317) includes electrically conductive pedestal features (321) extending towards the top IC surface, where the extending bump pads (311) physically contact one of the pedestal features (321) and electrically connect the IC die (310) to the workpiece (305). In the integrated circuit device (300), the pedestal features (321) increase a gap between the IC (310) and the workpiece top surfaces to be filled with an underfill dielectric material (332).

A method of manufacturing an organic electronic device, the method comprising: providing a substrate; forming a well-defining structure over the substrate; and depositing a solution of organic semiconductive material and/or organic conductive material in wells defined by the well-defining structure, wherein the well-defining structure is formed by depositing a solution comprising a mixture of a first insulating material and a second insulating material, the second insulating material having a lower wettability than the first insulating material, and allowing the first and second insulating materials to at least partially phase separate wherein the second insulating material phase separates in a direction away from the substrate.

This present invention discloses a waterborne polymer modified emulsified asphalt mixture and the preparation method thereof, and particularly relates to a waterborne polyurethane emulsified asphalt concrete, a waterborne acrylic resin emulsified asphalt concrete, and a waterborne epoxy resin emulsified asphalt micro-surfacing mixture, and preparation methods thereof. A mixture containing a waterborne polymer modified emulsified asphalt forms a high-performance composite system having a spatial network structure, and has good performance and simple preparation process.

Techniques for using multiple physiological parameters to provide an early warning for worsening heart failure are described. A system is provided that monitors a multiple diagnostic parameters indicative of worsening heart failure. The parameters preferably include are least one parameter acquired from an implanted device, such as intrathoracic impedance. The system device derives an index of the likelihood of worsening heart failure based upon the parameters using a Bayesian approach and displays the resultant index for review by a physician.

Improved protection systems for CIGS-based microelectronic devices of the type incorporating electric conductor(s) such as an electronic collection grid. In one aspect, the present invention relates to a photovoltaic device having a light incident surface and a backside surface. The device includes a chalcogenide-containing photovoltaic layer comprising at least one of copper, indium and/or gallium. A transparent conductive layer is interposed between the photovoltaic layer and the light incident surface, wherein the transparent conductive layer is electrically coupled to the photovoltaic layer. An electronic collection grid is electrically coupled to the transparent conductive layer and overlying at least a portion of the transparent conductive layer. An elastomeric structure having a light incident surface, said structure overlying at least portions of the electronic collection grid and the transparent conductive layer in a manner such that the light incident surface of the elastomeric structure is spaced apart from a major portion of the conductor, and wherein the elastomeric structure comprises an elastomeric siloxane polymer having a WVTR of at least 0.1 g/m²-day. An optional protective barrier overlies the elastomeric structure. The protection systems of the invention incorporate elastomers with water vapor transmission rates that are atypically high in the context of CIGS-based devices.

There are provided a soft magnetic material in the form of particles for suppressing occurrence of electromagnetic interference which is capable of exhibiting the suppressing effect in a broad frequency range from a low frequency band to a high frequency band, as well as an electromagnetic interference suppressing sheet using the material. When a conductive magnetic filler prepared by mixing a conductive carbon with soft magnetic particles at a volume ratio of 3 to 10:50 to 70 is highly filled in a sheet material, there can be obtained an electromagnetic interference suppressing sheet which is suitable for high-density mounting to electronic equipments, has an excellent electromagnetic absorption in a near electromagnetic field, and is fully suppressed from undergoing electromagnetic reflection thereon.

A welding electrode has a body having a shank and a contact region for placement against a workpiece during welding. A portion of the body may be formed on a parabolic profile. A coating is formed on the contact region. The coating may have a first layer, and a second layer formed over the first layer. The first and second layers may have different compositions. The electrode may have internally formed cooling finwork for interaction with a liquid cooling system.

A semiconductor device assembly (200) includes a workpiece (205) having a surface including a die attach region corresponding to regions under an integrated circuit (IC) die 210. The die attach region of workpiece (205) includes non-noble metal surfaces (215) and a plurality of flip chip (FC) pads at pad locations (214). A solder mask layer (207) is on a surface of the workpiece (205) outside the die attach region. The non-noble metal surfaces (215) in the die attach region include an adhesion promoter layer (221), wherein the adhesion promoter layer (207) is absent from the plurality of FC pads (214). An integrated circuit (IC) die (210) having a plurality of bumps (211) bonded in a flip chip arrangement to the workpiece (205). An underfill material (232) fills a space between the bumped IC die (210) and the workpiece (205).