Provided are a laminate capable of providing a temporary support for a member to be treated by a strongly adhesive force when the member to be treated is subjected to a mechanical or chemical treatment, and of easily releasing the temporary support for the treated member while not damaging the treated member, in which the TTV of the treated member is excellent; a composition for forming a protective layer; a composition for forming an adhesive layer; and a kit.
The laminate has, on a support (A), an adhesive layer having a softening point of 250° C. or higher (B), a protective layer (C), and a device wafer (D) in this order, in which the adhesive layer (B) is a cured product of an adhesive layer precursor and the adhesive layer precursor has a polymerizable compound (b-1).