Polymer film coated with a layer of silane coupling agent

Abstract

It is provided that a polymer film; a preparation method of the polymer film; and a laminated body used the polymer film. The polymer film is suitable for use in producing a laminate body which comprises a support and a polymer film, and is reduced in foreign-matter trapping and which can be used for supplying film devices using conventional apparatuses for glass substrates or silicon substrates. The polymer film coated with the layer of silane coupling agent, which is suitable for producing a laminate that comprises a support and a polymer film, comprises a silane coupling agent layer formed on at least one surface of the polymer film, wherein the silane coupling agent layer has a three-dimensional surface roughness (Sa) of 5.0 nm or less. The method of efficient for producing the polymer film coated with the above layer is the method for producing without using a vacuum.

Description

TECHNICAL FIELD[0001]The present invention relates to a polymer film suitable for producing a laminated body including a polymer film and a support, more particularly, to a polymer film which is capable of preparing a laminated body having heat resistance and which is suitable for preparing a film device including a laminated body in order to obtain a laminated body produced by, at the time of forming a device that is formed of a thin film of a semiconductor element, an MEMS element, a display element, or the like and that requires fine processing on a polymer film surface, temporarily or semi-permanently bonding a polymer film to a support made from an inorganic substance; a preparation method of the polymer film; a laminated body including the polymer film prepared by the method; and a flexible electronic device prepared by using the laminated body.BACKGROUND ART[0002]As electronic components in information communication equipment (e.g., broadcast equipment, mobile radios, portabl...

AI Technical Summary

Benefits of technology

[0052]The present invention can provide a good laminated body having no foreign matter between a polymer film and an inorganic substrate, and as a result, the adhesive strength between the polymer film and the inorganic substrate can be made even. Further, according to the present invention, it is possible to discriminately forming, in a desired pattern, a well adhering part having sufficient adhesive force so as not to generate peeling of a polymer film and an easily peelable part capable of peeling a polymer film relatively easily at the time of device formation process, and it is also possible to separate a functional element part formed in a corresponding part by slitting along the periphery of the easily peelable part, when an electronic device is formed with the presence / absence or strength / weakness of adhesive force in an intentional manner by partially masking a polymer film in a prescribed pattern for a silane coupling layer at the time of the silane coupling agent formation or by carrying out active energy beam irradiation along a prescribed pattern partially for a silane coupling agent layer after silane coupling agent layer formation.

[0053]The present invention makes the inorganic substrate surface highly smooth after polymer film peeling, and causes an effect to make the inorganic substrate usable as a material for a laminated body by relatively simple cleaning operation and by forming a silane coupling layer again.

[0054]The present invention can make the laminated body usable as a reinforcing substrate by bonding a polyimide film in the present invention for solar cells that have been made thinner, are made of single crystal or polycrystalline Si, are easily cracked due to the thinness, and thus have problems of handling during processing and of durability as final products. In this case, since there are parts easy to be peeled, a reinforcing substrate out of which electrodes can be led can be prepared.

[0055]In the present invention, use of a polymer film having high heat resistance is more preferable since the polymer film makes bonding possible without using an adhesive or a pressure sensitive adhesive inferior in heat resistance, and makes element formation possible at a high temperature of 180° C. or higher, preferably 230° C. or higher, and further preferably 260° C. or higher at the time of functional element formation. In general, since a semiconductor, a dielectric, or the like can be a thin film with better film quality when made at a higher temperature, formation of a functional element with higher performance can be expected. The present invention is useful for production of a flexible electronic device, which is a device such as a dielectric element, a semiconductor element, an MEMS element, a display element, a light emitting element, a photoelectric conversion element, a piezoelectric conversion element, a thermoelectric conversion element, and the like formed on a film.

Problems solved by technology

Although an adhesive or a pressure sensitive adhesive used for bonding a polymer film is also required to have sufficient heat resistance, polymer films which can stand practical use in the high temperature range are limited as actual problems, and presently, there is no conventional adhesive or pressure sensitive adhesive for bonding, which has sufficient heat resistance.

However, a polymer film obtained by the foregoing means is brittle and easy to be torn, so that the functional element may be often broken when the film is peeled from the inorganic substrate.

Particularly, peeling of a large surface device is so extremely difficult that it is not possible to achieve an industrially satisfactory yield.

The document concerns only the adhesion of polymer films, and does not perform control of the adhesion and peeling power of the coupling agent itself by UV light irradiation.

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