Multi-groove circulating silicon wafer cleaning machine

Abstract

The invention discloses a multi-groove circulating silicon wafer cleaning machine which comprises a machine shell, cleaning grooves, a water-supplying pipeline, and water-exhausting pipelines, wherein the cleaning grooves are at least groove bodies which are sequentially arranged. The groove bodies are sequentially composed of at least two difunctional cleaning grooves, at least two medicine-washing cleaning grooves, and at least two water-washing cleaning grooves which are of slow-lifting prewashing dewatering grooves. The difunctional cleaning grooves are used for pure water cleaning or medical liquid alkali cleaning, the medicine-washing cleaning grooves are used for medical liquid alkali cleaning, and the water-washing cleaning grooves are used for pure water cleaning. Overflowing pipes which are arranged between two adjacent groove bodies of the difunctional cleaning grooves are communicated with the groove bodies, and reverse sequence overflowing of the difunctional cleaning grooves is formed by the overflowing pipes. The water-exhausting pipes are connected with the overflowing pipes through tee joint valves, so that overflowing liquid can flow into a lower-level groove body or exhaust through the water-exhausting pipes, and thereby the difunctional cleaning grooves achieve dual functions of pure water cleaning and medical liquid alkali cleaning. The difunctional cleaning grooves of the multi-groove circulating silicon wafer cleaning machine can not only be used as alkali-cleaning grooves, but only can be used as water-washing grooves, facilitate adjusting and arranging of a silicon wafer cleaning working procedure, reduce water consumption through an overflowing manner, and save water resources.

Description

technical field [0001] The invention relates to a silicon chip cleaning machine, in particular to a multi-groove circulating silicon chip cleaning machine. Background technique [0002] In the production process of silicon wafers, in order to obtain good quality silicon wafers, it is required that the amount of impurities attached to the surface of the silicon wafers is extremely small. Therefore, the cut silicon wafers need to be cleaned. [0003] At present, the cleaning equipment used is a 7-tank cleaning machine. The 7-tank cleaning machine includes a casing, a cleaning tank installed in the casing, an ultrasonic device, a water supply pipeline for providing pure water, and a drainage pipeline for discharging cleaning liquid. Generally there are 7 and their functions are fixed. When the 7-tank cleaning machine is in operation, the transfer manipulator will put the cleaning baskets containing silicon wafers into 7 cleaning tanks for processing in sequence. Dry process a...

AI Technical Summary

Problems solved by technology

[0004] The existing 7-tank cleaning machine has the following defects: the cleaning method is very limited, and the 7 cleaning tanks are arranged in sequence, of which, the 3rd and 4th tanks are generally fixed medicine tanks (the silicon wafers are cleaned with liquid medicine), and the cleaning tanks are sequentially arranged. Among the 7 cleaning tanks arranged in the second order, the water in the rear tank body will be cleaner than the water in the front tank body. However, because the 3-4 tanks are equipped with liquid medicine for blocking, the pollution rate of the liquid medicine is greatly increased. As a result, the frequency of dressing changes is also increased, so the existing 7-tank cleaning machine has great restrictions on the process configuration of cleaning chemicals; in addition, if the cleaning tank overflows, only by opening the 7-tank cleaning machine The overflow device discharges it out of the body. In this way, the overflow liquid cannot be recycled, resulting in frequent water changes in the cleaning tank, which causes a great waste of water resources and increases the production cost of silicon wafers in disguise.

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