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Vertical non-volatile switch with punch through access and method of fabrication therefor

A punch-through and mechanism technology, applied in the direction of digital memory information, instruments, semiconductor devices, etc., can solve problems such as low-efficiency operation of devices

Inactive Publication Date: 2012-12-26
SEAGATE TECH LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as electronic devices become more complex, space issues such as noise and electrical shorts can make devices operate inefficiently

Method used

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  • Vertical non-volatile switch with punch through access and method of fabrication therefor
  • Vertical non-volatile switch with punch through access and method of fabrication therefor
  • Vertical non-volatile switch with punch through access and method of fabrication therefor

Examples

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Embodiment Construction

[0021] figure 1 A functional block diagram of a data storage device 100 constructed and operative in accordance with various embodiments of the invention is provided. Top-level control of device 100 is performed by a suitable controller 102, which may be a programmable or hardware-based microcontroller. Controller 102 communicates with a host device via controller interface (I / F) circuitry 104 . The memory space is shown at 106 to contain several memory arrays 108 (indicated as arrays 0-N), although it is understood that a single array may be utilized as desired. Each array 108 includes blocks of semiconductor memory having a selected storage capacity. Communication between controller 102 and memory space 106 is coordinated via I / F 104 .

[0022] Figure 2A A functional block diagram of a memory unit 110 constructed and operative in accordance with various embodiments of the invention is shown. The memory cell 110 has a resistive sense element (RSE) 112 in series with a s...

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PUM

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Abstract

A semiconductor device for accessing non-volatile memory cell is provided. In some embodiments, the semiconductor device has a vertical stack of semiconductor layers including a source, a drain, and a well. An application of a drain-source bias voltage to the semiconductor device generates a punchthrough mechanism across the well to initiate a flow of current between the source and the drain.

Description

Background technique [0001] Data storage devices generally operate to store and retrieve data in a fast and efficient manner. Some memory devices utilize semiconductor arrays of solid-state memory cells to store individual bits of data. Such memory cells may be volatile (eg, DRAM, SRAM) or non-volatile (RRAM, STRAM, Flash, etc.). [0002] As can be appreciated, volatile memory cells typically retain data stored in memory only as long as operating power is continuously supplied to the device, while non-volatile memory cells typically retain data in memory even when no operating power is applied. data storage. [0003] Generally, data storage devices, including select devices, are fabricated in a lateral configuration along a common substrate. However, as electronic devices become more complex, space issues such as noise and electrical shorts can cause devices to operate inefficiently. In this way, the vertical expansion of electrical components can reduce frequently encount...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/10G11C11/404H01L29/786H01L29/78H10B20/00H10B69/00
CPCG11C2213/79H01L29/8618H01L27/101G11C13/0002G11C11/1659G11C11/1673G11C11/1675H10N70/231H10B63/80
Inventor M·霍利H-K·李P·马诺斯C·郑Y·P·金
Owner SEAGATE TECH LLC