Detector and detection method for wafer position

Abstract

The invention discloses a detector and a detection method for wafer position. The detector comprises a carrying platform, a driving device, a blowing device, a camera device and an image processing device. The carrying platform is used for carrying a wafer. The driving device is connected with the carrying platform and is used for driving the carrying platform to rotate. The blowing device is arranged above the carrying platform and blows toward peripheral edges of the wafer on the carrying platform so as to dry the peripheral edges of the wafer. The camera device is arranged above the carrying platform and is used for taking images of the wafer on the carrying platform and sending the taken images to the image processing device. After the image processing device receives the images taken by the camera device, images in a partial area on the peripheral edges of the wafer are converted into a pixel, and the pixel and an image reference pixel in the partial area are compared, if the pixel and the image reference pixel are consistent, the wafer is placed on the carrying platform correctly, and if not, position of the wafer on the carrying platform is judged to deviate from correct position.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a wafer position detection device and a detection method. Background technique [0002] Semiconductor components are manufactured on semiconductor wafers using a number of different processing steps. Each step may involve different processing devices. Usually, the wafer is transported by a robot to each processing device for the process corresponding to each processing device. Processing, each processing device is usually equipped with a mounting table for mounting wafers. In order to process the wafers on the mounting table, it is necessary to place the wafer on the mounting table correctly without position deviation. If the wafer deviates from the correct position, it will have a negative impact on the reliability and process performance of the process. For example, in the process of manufacturing metal interconnection lines of semiconductor components, after the met...

AI Technical Summary

Problems solved by technology

Still taking the above-mentioned metal interconnection lines for making semiconductor components as an example, before the wafer is placed on the mounting table in the cleaning chamber for secondary cleaning and drying, there may be water films on the surface of the wafer in some places, while In some places, there is no water film phenomenon. This state of the wafer surface will affect the image data collection of the camera components, so that it is impossible to accurately detect whether the position of the wafer on the mounting table is correct, and it will cause hidden dangers for the secondary cleaning and drying process.

Images