Detector and detection method for wafer position

A detection device and detection method technology, applied in the direction of measuring devices, optical devices, semiconductor/solid-state device testing/measurement, etc., can solve the problem of affecting image data collection of camera components, inability to accurately detect wafers, secondary cleaning and drying processes Buried hidden dangers and other problems to achieve the effect of improving reliability

Active Publication Date: 2013-01-09
ACM RES SHANGHAI
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Problems solved by technology

Still taking the above-mentioned metal interconnection lines for making semiconductor components as an example, before the wafer is placed on the mounting table in the cleaning chamber for secondary cleaning and drying, there may be water films on the surface of the wafer in some places, while In some places, there

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  • Detector and detection method for wafer position
  • Detector and detection method for wafer position
  • Detector and detection method for wafer position

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[0019] In order to describe in detail the technical content, structural features, achieved objectives and effects of the present invention, the following will describe in detail in conjunction with embodiments and drawings.

[0020] See figure 1 with figure 2 , Is a schematic diagram of an embodiment of the wafer position detection device of the present invention. The wafer position detection device of the present invention includes a process chamber 10, a mounting table 20, a driving device 30, a blowing device 40, an imaging device 50, and an image processing device (not shown in the figure).

[0021] The process chamber 10 is used to perform corresponding process processing on the wafer W. In the present invention, the process chamber 10 can be used to perform wet cleaning and drying processing on the wafer W. The mounting table 20 has a circular carrying part 21 for placing the wafer W and a supporting part 22 whose one end is connected to the center of the carrying part 21 an...

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Abstract

The invention discloses a detector and a detection method for wafer position. The detector comprises a carrying platform, a driving device, a blowing device, a camera device and an image processing device. The carrying platform is used for carrying a wafer. The driving device is connected with the carrying platform and is used for driving the carrying platform to rotate. The blowing device is arranged above the carrying platform and blows toward peripheral edges of the wafer on the carrying platform so as to dry the peripheral edges of the wafer. The camera device is arranged above the carrying platform and is used for taking images of the wafer on the carrying platform and sending the taken images to the image processing device. After the image processing device receives the images taken by the camera device, images in a partial area on the peripheral edges of the wafer are converted into a pixel, and the pixel and an image reference pixel in the partial area are compared, if the pixel and the image reference pixel are consistent, the wafer is placed on the carrying platform correctly, and if not, position of the wafer on the carrying platform is judged to deviate from correct position.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a wafer position detection device and a detection method. Background technique [0002] Semiconductor components are manufactured on semiconductor wafers using a number of different processing steps. Each step may involve different processing devices. Usually, the wafer is transported by a robot to each processing device for the process corresponding to each processing device. Processing, each processing device is usually equipped with a mounting table for mounting wafers. In order to process the wafers on the mounting table, it is necessary to place the wafer on the mounting table correctly without position deviation. If the wafer deviates from the correct position, it will have a negative impact on the reliability and process performance of the process. For example, in the process of manufacturing metal interconnection lines of semiconductor components, after the met...

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Application Information

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IPC IPC(8): H01L21/67H01L21/66G01B11/00
Inventor 王坚何增华贾照伟王晖
Owner ACM RES SHANGHAI
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