Flexible circuit substrate and manufacturing method thereof
A flexible circuit substrate, one-party technology, applied in the direction of printed circuit manufacturing, printed circuit, printed circuit, etc., can solve the problems of device design and practical obstacles, wires can not be stretched, etc., to achieve easy wiring layer disconnection, simple structure, maintain The effect of connection reliability
Active Publication Date: 2016-01-20
NIPPON MEKTRON LTD
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Most of the above-mentioned robots and wearable electronic devices use electric wires for power supply and signal transmission, but the wires are usually made of copper wires, and the outer circumference is wrapped with an insulator, so the wires themselves are hardly stretchable.
Therefore, it is necessary to leave a margin when arranging the wires so as not to interfere with the movement of the robot or the human body, which often creates obstacles in the design and practicality of the device
Method used
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Experimental program
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Embodiment approach
[0071] to combine Figure 1 to Figure 6 , a flexible circuit board to which an embodiment of the present invention can be applied and a method for manufacturing the same will be described.
[0072] (1: Outline structure of flexible circuit board)
[0073] to combine figure 1 (a), figure 1 (b), Figure 4 (a) shows the schematic structure of the flexible circuit board of this embodiment. figure 1 (a), figure 1 (b), Figure 4 (a) respectively shows the schematic structure of the flexible circuit board of this embodiment.
[0074] Such as Figure 4 As shown in (a), the flexible circuit board 1 has an insulating film 2 formed of a thermoplastic resin, a wiring layer 3A formed on the insulating film 2, and an insulating layer formed of a thermoplastic resin formed on the wiring layer 3A. 4. The wiring layer 3A is adhered to the insulating film 2 via the adhesive layer 8 , but the wiring layer 3A may be directly provided on the insulating film 2 without the adhesive layer 8 ...
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Abstract
The present invention provides a flexible circuit substrate and a manufacturing method thereof. The flexible circuit substrate has a simple structure, can make the wiring expand and contract and / or twist and deform when the movable part of a robot and the like require telescopic wiring, and is light and flexible. It is excellent in quantification and miniaturization, and is less likely to cause disconnection and peeling of the wiring layer when repeated deformation. It is characterized in that the flexible circuit substrate 1 has an insulating film (2) formed of a liquid crystal polymer; a wiring layer 3A formed on the insulating film (2); and a wiring layer 3A formed on the wiring layer (3A) and formed of a liquid crystal polymer. The formed insulating layer (4) has a helical spiral portion (5) formed on at least part of it, and the spiral portion (5) can be stretched and / or torsionally deformed.
Description
technical field [0001] The invention relates to a flexible circuit substrate and a manufacturing method thereof. Specifically, the present invention relates to a flexible circuit substrate and a manufacturing method thereof, which are mainly used in various electronic devices such as communication and imaging devices, and are used to be installed between structural parts of automobiles, aircrafts, robots, etc. The connection of the connection, or the equipment circuit board equipped with assembly parts, especially, the movable part of the robot and other parts that require flexibility. Background technique [0002] In recent years, robots have developed rapidly, and robots that can perform various actions have appeared. In the field of wearable electronic devices that can be mounted on the human body or clothing, various devices have also been developed. Most of the above-mentioned robots and wearable electronic devices use electric wires for power supply and signal transm...
Claims
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IPC IPC(8): H05K1/02
CPCH05K1/0218H05K2201/0129H05K2201/0141H05K2201/051H05K2203/1105Y10T29/49117H05K1/028H05K2201/057H05K1/189
Inventor 加治屋笃吉原秀和
Owner NIPPON MEKTRON LTD