Solder Recovery for Wave Soldering Nozzles
A solder and nozzle technology, applied in the field of solder recycling for wave soldering nozzles, can solve the problems of increasing process cost, reducing process yield, and high cost of lead-free solder
Inactive Publication Date: 2015-12-16
FLEXTRONICS AP LLC
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- Description
- Claims
- Application Information
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Problems solved by technology
With current wave soldering apparatus and methods, the advent of lead-free solders has resulted in reduced process yield and increased process cost
Regardless of the solder alloy, currently available equipment and process technologies are limited in their ability to accommodate lead-free solders and newer and more challenging products
Also, lead-free solder costs more than tin-lead or other types of solder
Method used
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[0019] While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof have been shown by way of example in the drawings and described in detail herein. It should be understood, however, that the invention should not be considered limited to the particular forms disclosed, but is to cover all modifications, equivalents and alternatives falling within the scope and spirit of the invention as defined by the claims.
[0020] figure 1 A perspective view of a wave soldering machine or apparatus 10 is illustrated, according to one embodiment. As shown, the wave soldering apparatus 10 may include a housing 11 containing a plurality of workstations such as a flux application station 12 , a preheat station 14 and a wave soldering station 16 . A controller (not shown) with an operating monitor can control the operation of the wave soldering apparatus 10 in a well-known manner. As shown, an electronic substrate 20 (eg, a printed circuit b...
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The present invention relates to a solder recovery device (100) for a wave soldering machine (10) which collects the solder exiting the nozzle and recovers the solder to a solder reservoir (24) while limiting the ability of the solder to sputter onto electronic substrates such as , printed circuit boards), components of wave soldering machines, and so on. The device includes a mounting portion (114) that can be placed over the upper surface of the nozzle and a collection portion (116) that collects and recycles the solder to the solder reservoir (24). The collection portion (116) includes a trough (126) having an indentation (140) in the bottom wall of the trough and a flow control member (144) capable of regulating the amount of solder leaving the trough and the velocity of the solder leaving the trough . One or more deflector plates (156) may be mounted to extend from the slot into the solder in the solder reservoir to further contain the solder and limit the extent to which sputtered solder can reach unintended locations.
Description
Background technique [0001] The basis of electronics manufacturing is the need to make a series of electrical connections (for example, with solder alloys) to create circuits and ultimately to create functional devices in final assembly. Wave soldering machines allow a large number of electrical connections between components to be made quickly and efficiently. In a wave soldering machine, the electronic substrate is moved by a conveyor, typically on an inclined lane, through the flux station, the preheat station and causing at least one wave of solder to flow up through the nozzle and contact the portions of the electronic substrate to be soldered. [0002] Wave soldering machines typically utilize a tin-lead alloy as the solder material, which has been the industry norm for over 40 years. Recently, however, tin-lead alloys have been replaced by lead-free alloys. Frequently, the change is mandated by international legislation. With current wave soldering apparatus and meth...
Claims
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IPC IPC(8): B23K1/08B23K3/06H05K3/34
CPCB23K1/0008B23K1/085B23K1/203B23K3/0653B23K2101/42
Inventor L.扬纳罗斯F.瓦格纳
Owner FLEXTRONICS AP LLC