Device and method for single-surface wet treatment of substrate wafers

Abstract

The invention relates to a device for the wet treatment of substrate wafers. The device comprises a plurality of pools each of which has at least a first inlet for introducing a process liquid and a flat, horizontally oriented upper edge. A transport unit is provided for transporting the substrate wafers passing at least two pools arranged in a row along a transport direction of the transport unit, wherein the transport unit comprises a plurality of substrate conveying elements arranged outside the pools, and the substrate conveying elements contact with a substrate to be conveyed from the bottom and convey the substrate. A method for the wet treatment of substrate wafers is also described in which substrate wafers are transported by a transport unit along a transport direction passing at least two pools which are arranged one after another in the transport direction. During the transport process, the substrate wafers are arranged on at least two substrate conveying elements which are arranged outside the pools, and which contact the substrate wafers from the bottom, wherein the process liquid is introduced into the pools such that the process liquid at least locally exceeds an upper edge of the pool, and wherein the substrate wafers are transported such that the process fluid contacts the bottom of the substrate wafers.

Description

technical field [0001] The invention relates to a device and a method for the wet processing of substrate wafers, in particular semiconductor wafers for the semiconductor and / or photovoltaic industry. Background technique [0002] When producing electronic components such as memory chips, microprocessors, but also in the field of photovoltaics or flat-panel displays, various production steps are necessary for producing end products. In this case, the different layers for forming the electronic components are deposited onto corresponding substrate wafers, for example during the manufacture of the product. In this case, wet processing of the substrate wafer is always necessary. In this case, it is necessary to selectively expose only one side of the substrate wafer and, if necessary, the sides of the substrate wafer to the process liquid. A common example of a corresponding wet process is an etching process in which only one side of the substrate wafer is exposed to the etch...

AI Technical Summary

Problems solved by technology

[0005] In addition, due to the larger surface area of ​​the process bath, there is more evaporation of the process liquid, which can deposit on the top surface of the unprocessed wafers and cause undesired gas phase reactions there

Correspondingly large-area suction is difficult due to unfavorable airflows due to strong suction in the process area

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