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Multi-channel compound heat radiating sealing chassis

A compound sealing and multi-channel technology, which is applied in the field of electronic equipment, can solve the problems of large thermal resistance and poor heat dissipation performance, and achieve the effect of increasing heat transfer area, low thermal resistance path, and improving heat transfer efficiency

Inactive Publication Date: 2015-05-13
CNGC INST NO 206 OF CHINA ARMS IND GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to avoid the deficiencies of the prior art, the present invention proposes a multi-channel composite sealed enclosure for electronic enclosures, which is a solution to the problems of large thermal resistance and poor heat dissipation performance of existing electronic equipment during conduction and heat dissipation. Applied to military and civilian product fields that require high sealing, electromagnetic shielding and heat dissipation of electronic equipment

Method used

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  • Multi-channel compound heat radiating sealing chassis
  • Multi-channel compound heat radiating sealing chassis
  • Multi-channel compound heat radiating sealing chassis

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Embodiment Construction

[0022] Now in conjunction with embodiment, accompanying drawing, the present invention will be further described:

[0023] The working principle of this multi-channel compound heat dissipation sealed chassis is: based on the compound channel heat dissipation mode of the inner and outer double-fin structure, the cooling method combining conduction and forced air cooling is adopted. Both sides of the chassis are double-layered, and the heat of the internal modules is brought into the first channel by means of the inner fan cooling and side wall conduction. Heat away.

[0024] The chassis is mainly composed of chassis frame, side heat exchange plate, inner partition plate, rear end heat exchange plate, outer sealing plate, rear sealing plate, front panel and upper and lower cover plates. When the requirements for electromagnetic compatibility are high, a shielding plate can be installed at the bottom of the chassis to reduce the influence of motherboard and cable radiation on th...

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Abstract

The invention relates to a multi-channel compound heat radiating sealing chassis which is characterized in that outer sealing plates are arranged on two sides of a chassis frame, an upper cover plate and a lower cover plate are arranged on and under the chassis frame, two ends of the chassis frame are provided with a front panel and a rear sealing plate, a fan is arranged on the rear sealing plate, a connector frame is arranged inside the chassis frame, a separation plate for separating a strong current region and a weak current region is arranged on the connector frame, a side wall heat radiating fin is arranged on the connector frame in the strong current region, an installing plate is arranged on one side of the weak current region, which is positioned on the rear sealing plate, an inner fan is arranged on the installing plate, an inner separation plate is arranged between the inner fan and the rear sealing plate, heat radiating fins are arranged on two ends of the inner separating plate; and two side surface heat exchange plates are arranged on two sides of the chassis frame and positioned between the chassis frame and the outer sealing plates. According to the invention, by adopting a method of combining conduction with secondary forced heat radiation, the problem of heat radiation of a high-density and large-power sealing electronic device can be effectively solved.

Description

technical field [0001] The invention belongs to the three technical fields of machinery, heat and electromagnetics, and relates to a multi-channel composite sealed case used in an electronic case, and an electronic device with good airtightness and electromagnetic shielding function. Background technique [0002] Chassis are widely used in electronic equipment. Traditional chassis mainly rely on conduction heat dissipation: internal modules conduct heat to the chassis shell through structures such as locking strips or thermal pads, and the outside of the chassis takes heat away through natural convection or forced convection, and the chassis acts as a heat exchanger. The problem is that the contact thermal resistance is large and the heat conduction efficiency is not high. At present, electronic equipment is developing towards high density, high power, and miniaturization. The unit heat flux value in electronic equipment is increasing, and the temperature is getting higher ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K5/06H05K7/20H05K9/00
Inventor 胡凯博方伟奇张镝张涛曹锋付学斌
Owner CNGC INST NO 206 OF CHINA ARMS IND GRP
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