A method for attaching substrates

A substrate and bonding technology, applied in chemical instruments and methods, layered products, lamination devices, etc., can solve problems such as glue overflow and hard curing, and achieve the effects of shortening the production cycle, reducing costs, and improving production efficiency

Inactive Publication Date: 2016-12-14
惠州大唐伟业电子有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to provide a bonding method that prevents glue overflow and is easy to cure, so as to solve the problem of glue overflow and difficult curing in the bonding process of the prior art

Method used

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  • A method for attaching substrates
  • A method for attaching substrates
  • A method for attaching substrates

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Embodiment Construction

[0033] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0034] refer to Figure 3-Figure 5 As shown, the bonding method of the substrate of the present invention comprises the following steps:

[0035] S1: Select the prepared substrate capacitive touch screen 5 and cover glass 1, and apply liquid ultraviolet curable glue 4 on the surface of the substrate capacitive touch screen 5;

[0036] The liquid ultraviolet curable glue 4 is coated on the surface of the substrate capacitive touch screen 5 by trickling or dripping or pouring or printing.

[0037] S2: apply the hardener 3 on the back of the printed part 2 of the cover glass;

[0038] The cover gla...

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Abstract

The invention provides a bonding method of a substrate, which includes the following steps: S1: select the prepared substrate capacitive touch screen and cover glass, and apply ultraviolet curable glue on the surface of the substrate capacitive touch screen; S2: apply the hardener Apply on the back of the printed part of the cover glass; S3: Lay the capacitive touch screen and the cover glass together, and make the ultraviolet hardening glue spread and level to fill the bonding surface of the capacitive touch screen and the cover glass; S4: irradiating the ultraviolet curing adhesive through the cover glass through ultraviolet rays. By applying the hardener, the phenomenon of overflowing glue on the edge of the capacitive touch screen is avoided, and the problem of hard curing of the ultraviolet hardening glue on the printing part of the cover glass and the flexible circuit board is solved; a lot of manpower and material resources are saved, and the operation is simple. The production cycle is shortened, the production efficiency is improved, the qualification rate of the product is improved, and the cost is reduced.

Description

technical field [0001] The invention relates to a bonding process. Background technique [0002] refer to figure 1 , figure 2 As shown, in the field of flat-panel displays and touch screens, the capacitive touch screen 5' and the cover glass 1' are bonded with ultraviolet curing glue 4', which is made by adding a photoinitiator to a specially formulated resin and absorbing ultraviolet rays. After 100' of high-intensity ultraviolet light in the photocuring equipment, active free radicals or ionic radicals are generated, thereby initiating polymerization, cross-linking and grafting reactions, so that the resin is transformed from liquid to solid in a few seconds, and the capacitive touch screen 5' It is fixed together with the cover glass 1'. However, there are the following problems in the bonding process: 1. There is glue overflow on the 5' edge of the capacitive touch screen during bonding, which affects the assembly accuracy; 2. When curing after bonding, at the printe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/12
Inventor 何丽丽
Owner 惠州大唐伟业电子有限公司
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