PCB (printed circuit board) structure available for grafting and transplanting and PCB structure grafting method

Abstract

The invention discloses a PCB (printed circuit board) structure available for grafting and transplanting. The PCB structure comprises a master grafting board and a slave grafting board, the master grafting board is provided with an operating side which is provided with at least one concave clamping groove, the slave grafting board is provided with at least one convex connector, and the slave grafting board is coincided with the concave clamping grooves through the convex connectors. The invention further discloses a grafting method for the PCB structure available for grafting and transplanting. The method includes the technical procedures: removing defective units; selecting the slave grafting board; planting the selected slave grafting board at the defective unit position of the master grafting board, and leveling the slave grafting board and the master grafting board on the same plane; and adding macromolecule adhesives at the joint. Accepted products of multi-layer PCBs which meet the requirements can be processed by the grafting method for the PCB structure available for grafting and transplanting, the precision and reliability requirements can be met, the integral appearances of the multi-layer PCBs are unaffected, production efficiency is improved, production cost is reduced, and great economy and environment friendliness are achieved.

Description

technical field [0001] The invention relates to a grafting structure and a grafting method of defective units of multiple PCB boards, in particular to a graftable and transplantable PCB board structure and a grafting method thereof. Background technique [0002] At present, due to various reasons in the production process of multi-piece PCB boards, it is inevitable that a single or several units have defects, resulting in unit scrapping; component placement is a multi-piece operation, and the scrapped units are also mounted with electronic components during the operation. devices, resulting in unnecessary waste of resources. However, to solve this problem in the industry, in-line bonding technology is often used to repair and replace unqualified sub-circuit boards, but this existing technology will lead to poor connection of circuit boards, low alignment accuracy, poor appearance quality, complicated procedures, and excessive costs. High-level problems, and in order to achi...

AI Technical Summary

Problems solved by technology

[0002] At present, due to various reasons in the production process of multi-piece PCB boards, it is inevitable that a single or several units have defects, resulting in unit scrapping; component placement is a multi-piece operation, and the scrapped units are also mounted with electronic components during the operation. devices, resulting in unnecessary waste of resources

However, to solve this problem in the industry, in-line bonding technology is often used to repair and replace unqualified sub-circuit boards, but this existing technology will lead to poor connection of circuit boards, low alignment accuracy, poor appearance quality, complicated procedures, and excessive costs. High-level problems, and in order to achieve the purpose of firmly bonding the PCB board, many manufacturers use high-quality adhesives to bond the joint parts to make up for the defects in the mechanical connection of the joint parts, which increases the production cost of the enterprise

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