Concave pit notching and cutting composite mould for integrated chip lead frame

Abstract

The invention discloses a concave pit notching and cutting composite mould for integrated chip lead frame, overcomes the defect of singular notching of the conventional notching mould, and provides the composite mould which is precise in notching, system positioning and cutting. The concave pit notching and cutting composite mould comprises an upper mould seat, a lower mould seat and a controller; the upper and lower moulds are slidingly connected through four guide mechanisms; movable sliders are arranged on guide columns; a concave mould is arranged on the lower mould seat; a square concave pit is formed in the middle of the concave mould; positioning pins are symmetrically arranged on front and back sides of the square concave pit; a square through hole is formed in the corresponding part of the movable sliders and the square concave pit; a positioning pin hole is formed in the corresponding part of the movable sliders and the square concave pit; a convex mould is arranged in the middle of the upper mould seat; the head of the convex mould slidably penetrates through the square through hole; a height adjusting device is arranged at the upper end of the convex mould; a fixed length transmission device of the integrated chip lead frame is arranged on the left side of the lower mould seat; and a cutting device of the integrated chip lead frame is arranged on the right side of the lower mould seat. By the concave pit notching and cutting composite mould, the concave part can be notched precisely; the system positioning is precise, and fixed length cutting is accurate; and guide rail error of a punching machine can be prevented.

Description

technical field [0001] The invention belongs to the technical field of stamping dies for integrated chip lead frames, and in particular relates to a die for punching and cutting base islands of integrated chip lead frames. Background technique [0002] The integrated chip lead frame includes a chip island in the center and a group of pins on the periphery. The bottom of the chip island is provided with a certain degree of concavity, called the base island. The base island is set for chip embedding. The base island needs to pass through The stamping process is completed. This stamping process is generally carried out continuously, that is, the coiled material of the integrated chip lead frame is intermittently transferred to the concave die, and the base island is concaved under the condition of precise positioning. After the concave is completed, the integrated chip lead frame The coil is precisely cut by the cutting mold; the dimensional accuracy, position accuracy and shap...

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to overcome the defects of single punching and separate positioning of the punching and concave die lacking the precision transmission device and the precision cutting device in the prior art, and to provide a fixed-length transmission device and the precision cutting device , Integrated chip lead frame base island punching and cutting composite mold with system positioning and precision punching

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