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Wafer drying equipment and forming method thereof

A wafer drying and equipment technology, applied in drying solid materials, lighting and heating equipment, drying, etc., can solve the problems of high cost and poor quality, and achieve the effect of low cost, good quality and uniform thickness

Active Publication Date: 2013-02-06
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] High cost and poor quality of prior art wafer drying equipment

Method used

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  • Wafer drying equipment and forming method thereof
  • Wafer drying equipment and forming method thereof

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Embodiment Construction

[0035] As mentioned in the background, the wafer drying equipment in the prior art has high cost and poor quality.

[0036] After research, the inventors found that the baffles of the wafer drying device in the prior art are made of high-cost and easily broken quartz glass, and workers can easily damage the baffles during transportation, installation or disassembly. Normal operation of the wafer drying unit.

[0037] If the baffle plate of the wafer drying device is replaced with an unbreakable material, the cost can be greatly reduced and the normal operation of the wafer drying device can be guaranteed. After further research, the inventors found that the wafers put into the wafer drying device are usually just taken out of the cleaning device, and the surface of the wafer taken out of the cleaning device still has cleaning liquid. In the cleaning liquid, in addition to In addition to large amounts of moisture, hydrofluoric acid (HF) is usually included. Put the wafer with...

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Abstract

The invention provides wafer drying equipment and a forming method thereof. The wafer drying equipment comprises a drying cavity, a rotating device and a baffle, wherein an opening is formed at the top wall of the drying cavity; the opening is used for providing a channel for taking out or placing a wafer into the drying cavity; the rotating device is located on the lateral wall of the drying cavity; the rotating device is used for clamping the wafer to rotate at a high speed, so as to spin liquid drops on the surface of the wafer; the baffle corresponds to the opening; the baffle comprises fixed baffles located at the both sides of the opening and a movable baffle located between the two fixed baffles; the movable baffle is opened when the wafer is taken out or placed in the drying cavity, and is closed after the wafer is placed in the drying cavity, so that the drying cavity is sealed; and the fixed baffle near one side of the rotating device comprises a substrate layer which is difficult to crash and an anti-corrosion coating covering the entire surface of the substrate layer. The wafer drying equipment provided by the invention has the advantages of low cost and good quality.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer drying device and a forming method thereof. Background technique [0002] Cleaning is one of the most important and frequent steps in the manufacturing process of semiconductor devices. After the wafer is cleaned, in order to avoid the impact of residual moisture or residual cleaning liquid on the wafer on the subsequent process, the wafer is generally placed in a drying device for drying. [0003] Please refer to figure 1 , the prior art drying equipment, usually rotary drying equipment, including: [0004] The drying chamber 100 is located at the opening 130 on the top wall of the drying chamber 100 for providing a passage for putting the wafer into the drying chamber 100; [0005] The rotary head 110 located on the side wall of the drying cavity 100, in the working state, the rotary head 110 rotates at a high speed; [0006] Installed on the spi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F26B25/00H01L21/67H01L21/02
Inventor 董呈龙
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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