Method for preparing high toughness epoxy resin matrix by using heat fusion method
A technology of tough epoxy resin and epoxy resin, which is applied in the field of resin matrix preparation of composite materials, can solve the problems of sacrificing the mechanical properties of composite materials, increasing the cost, and preparing prepreg materials, etc., so as to avoid a large and rapid viscosity. Rising, adaptable effects
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Embodiment 1
[0021] 1) Traditional resin preparation method (medium toughness epoxy resin system preparation):
[0022] Weigh 75 parts of E51 epoxy resin, 25 parts of AG80 epoxy resin, and 15 parts of 200-mesh polyetherimide (PEI) powder, stir and mix evenly, then heat to 150°C±10°C and keep warm until PEI is completely dissolved Finally, add 30 parts of diaminodiphenylmethane (DDM) powder, stir well to make the DDM completely dissolved to form a uniform, transparent and semi-viscous resin system, pour it out and cool it quickly, then it can be used in the hot melt prepreg process;
[0023] 2) The preparation method of the present invention (preparation of high toughness epoxy resin system):
[0024] Based on the above-mentioned traditional resin preparation method, first weigh 75 parts of E51 epoxy resin and 25 parts of AG80 epoxy resin, stir and mix evenly, then heat to 150°C±10°C, add 30 parts of DDM powder, and stir fully to make DDM Dissolve completely to form a uniform transparent r...
Embodiment 2
[0031] 1) Traditional resin preparation method:
[0032] Weigh 100 parts of TDE86 epoxy resin, 25 parts of F51 epoxy resin, 15 parts of E12 epoxy resin, add 15 parts of 1000 mesh polyethersulfone, heat to 140°C±10°C, and wait until the polyethersulfone (PES) is completely dissolved Finally, add 20 parts of dicyandiamide (DICY) and stir evenly, and mechanically stir for about 5 minutes to form a uniform resin system and quickly cool to room temperature.
[0033] 2) The preparation method of the present invention (preparation of high toughness resin system):
[0034] Weigh 100 parts of TDE86 epoxy resin, 25 parts of F51 epoxy resin, and 15 parts of E12 epoxy resin, heat to 120°C±10°C, mix well, add 20 parts of dicyandiamide, stir well, and quickly cool down to 110°C Next, add 30 parts of 1000 mesh to 2000 mesh polyethersulfone, and mechanically stir for about 10 minutes to form a uniform resin system and quickly cool to room temperature.
[0035] Mix the cooled resin for 1 to ...
Embodiment 3
[0041] 1) Traditional resin preparation method:
[0042]Weigh 30 parts of 711 epoxy resin, 30 parts of AFG90 epoxy resin, 40 parts of EX40 epoxy resin, and 10 parts of polysulfone (PSF), mix well, heat to 150°C±10°C and wait until the polysulfone is completely dissolved, quickly After cooling down to 90°C±10°C, add 40 parts of hexahydrophthalic anhydride and stir evenly, and mechanically stir for about 10 minutes to form a uniform resin system and quickly cool to room temperature.
[0043] 2) The preparation method of the present invention (preparation of high toughness resin system):
[0044] Weigh 30 parts of 711 epoxy resin, 30 parts of AFG90 epoxy resin, 40 parts of EX40 epoxy resin, heat to 90℃±10℃, mix well, add 40 parts of hexahydrophthalic anhydride and stir evenly, then add Mesh 30 parts of polysulfone, mechanically stirred for about 10 minutes to form a uniform resin system, which can be used in the hot-melt prepreg process after cooling to room temperature quickly....
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