Unlock instant, AI-driven research and patent intelligence for your innovation.

Surface mounting technology for components of integrated electronic modules

A technology of surface mount technology and electronic components, which is applied in the field of electronics and can solve problems such as poor accuracy and low efficiency

Inactive Publication Date: 2013-02-27
DFINE TECH
View PDF4 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims to solve the technical problems of low efficiency and poor accuracy in the surface mounting of existing small-batch integrated electronic product module components, so as to provide a surface mount process for integrated electronic module components with the advantages of high efficiency and high accuracy.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] The detailed structure, application principle, function and efficacy of the present invention are described through the following embodiments.

[0021] The surface mounting process of integrated electronic module components of the present invention comprises the following steps:

[0022] a) Arrange all the electronic components that need to be mounted on the surface of the integrated electronic module components according to the following rules:

[0023] 1) First sort the electronic components according to their size, with the small ones first and the large ones last, then paste the small chip components first, and then paste the tall components;

[0024] 2) The electronic components of the same size are sorted according to the difficulty of placement, the easy-to-attach sorting is in the first place, and the difficult-to-stick sorting is in the last;

[0025] 3) The order of the same type of components is sorted;

[0026] b) Group all the above-mentioned sorted elect...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a surface mounting technology for components of integrated electronic modules, relates to the technical field of electronics, and solves the technical problems of low efficiency, poor accuracy and the like in surface mounting of the components of the conventional small-batch integrated product modules. The surface mounting technology comprises the following steps: a) sorting all the electronic components of the integrated electronic modules to be subjected to surface mounting by rules; b) sequentially dividing all the sorted electronic components into groups each comprising 3-7 electronic components, taking each group as a process, and distributing a unique identifier to each group; c) marking the identifiers in corresponding positions of an assembly drawing of the components of the integrated electronic modules; and d) carrying out electronic component surface mounting according to the marked assembly drawing of the components of the integrated electronic modules.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a surface mounting process applied to integrated electronic module components. Background technique [0002] For small batches of integrated electronic products, a module often has dozens of mounting boards or a small number of mounting boards and a large number of components. In the product development and trial production stages, the output is very small, and usually only rely on simple SMT production equipment: Manual screen printing station, manual SMT wire body, reflow soldering machine. When the printed circuit board is mounted and produced, simple stencil screen printing solder paste is used, and the workers manually paste the components on the printed circuit board one by one according to the designed electrical installation drawing and assembly details. Soldering is performed through a reflow oven. This is not a big problem for printed circuit boards with less than...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/30
Inventor 肖攀
Owner DFINE TECH