A processing method for exposing a circuit board by using a dust-proof support frame

Abstract

The invention discloses a processing method for utilizing a dustproof support frame to perform manual alignment exposure on a circuit board. The processing method for utilizing the dustproof support frame to perform manual alignment exposure on the circuit board comprises manual alignment of the circuit board and further comprises the steps of circuit board preparation, circuit board single-side film alignment, inspection of alignment effect, overturning of the circuit board, alignment of a film on the other side of the circuit board, inspection of alignment effect and exposure. According to the method, impurities of dry film fragments and the like generated in the manual alignment process of the circuit board fall to the bottom of the dustproof support frame, pollution to the circuit board is avoided, line defects are avoided, and the product qualification rate is greatly improved. In addition, the circuit board undergoes manual alignment on the dustproof support frame, the contact area between the circuit board and the dustproof support frame is small, potential scratch hazards of the surface of the circuit board and the surface of the film are greatly reduced, the product qualification rate is improved, the service life of the film is prolonged, and the manufacturing cost is reduced.

Description

technical field [0001] The invention relates to a processing method for exposing circuit boards in a hand-to-hand manner. Background technique [0002] The production of the outer graphic circuit of the printed circuit board adopts the process of aligning the printed circuit board with a film, and transferring the film circuit to the printed circuit board after exposure. The processing methods of this process are generally divided into two types: automatic exposure and manual exposure. Automatic exposure adopts the combination of CCD and alignment target. The exposure machine automatically captures the alignment target and exposes it. The alignment accuracy is high, but the general equipment is expensive and easy to damage; while manual exposure only needs a simple alignment A workbench and a cheap manual exposure machine are enough, the operation is simple and the price is low. However, due to the need to manually align the printed circuit board during the manual exposure...

AI Technical Summary

Problems solved by technology

Automatic exposure adopts the combination of CCD and alignment target. The exposure machine automatically captures the alignment target and exposes it. The alignment accuracy is high, but the general equipment is expensive and easy to damage; while manual exposure only needs a simple alignment A workbench and a cheap manual exposure machine are enough, the operation is simple and the price is low

However, due to the need to manually align the printed circuit board during the manual exposure process, it is inevitable that the dry film debris on the edge of the board will fall on the work surface, and the dry film debris will easily adhere to the film during alignment, resulting in graphic line

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