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Environment-friendly electro-coppering liquid

A copper electroplating and environmental protection technology, applied in the field of electroplating, can solve the problems of poor coating adhesion, complex maintenance of the plating solution and high cost, and achieve the effects of low cost, good coating adhesion and wide density range.

Inactive Publication Date: 2013-03-20
NANTONG HUIFENG ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the pyrophosphate copper plating system has been widely used in production, but generally requires cyanide pre-plating copper treatment, which has certain pollution, poor bonding force of the plating layer, complex maintenance of the plating solution, and high cost

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] A kind of environment-friendly electroplating copper solution of the present invention, this environment-friendly electroplating copper solution is made up of following composition:

[0019] Main binder: disodium edetate 100g / L;

[0020] Auxiliary binder: trisodium citrate 20g / L;

[0021] Main salt: copper sulfate 10g / L;

[0022] Conductive salt: sodium nitrate 5-10g / L;

[0023] PH value adjuster: sodium hydroxide 25-50g / L.

Embodiment 2

[0025] A kind of environment-friendly electroplating copper solution of the present invention, this environment-friendly electroplating copper solution is made up of following composition:

[0026] Main binder: Dipotassium EDTA 120g / L;

[0027] Auxiliary binder: tripotassium citrate 30g / L;

[0028] Main salt: basic copper carbonate 30g / L;

[0029] Conductive salt: Potassium nitrate 7g / L;

[0030] PH value regulator: potassium hydroxide 40g / L.

Embodiment 3

[0032] A kind of environment-friendly electroplating copper solution of the present invention, this environment-friendly electroplating copper solution is made up of following composition:

[0033] Primary binder: a mixture of disodium edetate and dipotassium edetate 140g / L;

[0034] Auxiliary binder: potassium sodium tartrate 35g / L;

[0035] Main salt: copper sulfate and basic copper carbonate mixture 35g / L;

[0036] Conductive salt: sodium nitrate and potassium nitrate mixture 8g / L;

[0037] PH value regulator: sodium hydroxide and potassium hydroxide mixture 40g / L.

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PUM

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Abstract

The invention discloses an environment-friendly electro-coppering liquid which is characterized by comprising a main binder, an auxiliary binder, a main salt, a conductive salt and a pH value conditioning agent, wherein the binder is disodium ethylene diamine tetraacetate or dipotassium ethylene diamine tetraacetate with a concentration of 100 to 150 g / L, the auxiliary binder is trisodium citrate, tripotassium citrate or potassium sodium tartrate with a concentration of 20 to 35 g / L, the main salt is copper sulphate or basic cupric carbonate with a concentration of 10 to 40 g / L, the conductive salt is sodium nitrate or potassium nitrate with a concentration of 5 to 10 g / L, and the pH value conditioning agent is sodium hydroxide or potassium hydroxide with a concentration of 25 to 50 g / L. The environment-friendly electro-coppering liquid provided by the invention has the following advantages: the electro-coppering liquid is a cyanide-free plating solution which is environment-friendly and nontoxic, easy to operate and maintain and applicable to direct electroplating on the surface of steel wires; the electro-coppering liquid has good polarization performance, high cathodic current efficiency and a wide density scope; and a coating formed by the liquid has good bonding force and is simple to maintain and low in cost.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to an environmentally friendly electroplating copper solution. Background technique [0002] The cyanide electroplating copper layer has fine crystallization, good bonding force, good leveling, leveling and stability of the plating solution, and can be directly electroplated on steel wire, zinc and zinc alloy substrate parts. However, the cyanide electroplating copper solution contains cyanide ions, which is highly toxic, difficult to handle waste water and liquid waste, seriously pollutes the environment, and endangers human health. Therefore, people have been looking for an environmentally friendly copper plating process that can replace cyanide electroplating copper. The existing cyanide-free copper plating processes mainly include pyrophosphate electroplating copper plating and sulfate electroplating copper plating. Among them, the pyrophosphate copper plating system ha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38
Inventor 黄锋
Owner NANTONG HUIFENG ELECTRONICS TECH
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