Structured circuit board and method

A technology of circuit boards and conductive vias, applied in circuits, printed circuits, printed circuits, etc., can solve problems such as signal loss, achieve the effects of reducing separation, reducing manufacturing costs, and reducing crosstalk

Active Publication Date: 2013-03-20
FRAMATOME CONNECTORS INT SA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Signals transmitted over a transmission line having a first section of one geometry bordering a second section of another geometry may suffer significant loss at the junction between the first and second sections
[0003] It is also generally known that transmission lines arranged close to each other can exhibit signal crosstalk

Method used

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  • Structured circuit board and method
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  • Structured circuit board and method

Examples

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Embodiment Construction

[0026] Note that the views are schematic, not necessarily to scale, and details not necessary for an understanding of the invention may have been omitted. The terms "upward", "downward", "below", "above" etc. relate to the embodiment as oriented in the views. In addition, elements that are at least substantially the same or perform at least substantially the same function are denoted by the same reference numerals.

[0027] figure 1 show figure 2 A cross section of a part of a prior art multilayer circuit board 1 shown in top view in . figure 2 yes figure 1 A top view of circuit board 1, indicating the figure 1 section. The circuit board 1 includes a plurality of insulating layers 3 separated by a plurality of ground layers 5 and a plurality of layers including signal traces 7 ( figure 1 Only one signal trace is shown in 7). The insulating layers may be substantially identical or may differ from each other in one or more respects, in particular in size and / or in one o...

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PUM

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Abstract

A circuit board (1) is provided comprising a plurality of insulating layers, at least one ground layer and at least one layer comprising signal traces. The circuit board comprises at least a first conductive via (17) and a second conductive via (17). The first conductive via and the second conductive via penetrate through at least a first insulating layer of the plurality of insulating layers and are connected to a signal trace. The first conductive via and the second conductive via are arranged adjacent each other. At least in the first insulating layer the first conductive via and the second conductive via are separated in a first direction of separation (R) by a first adjustment portion comprising a dielectric material property different from the first insulating layer.

Description

technical field [0001] The present disclosure relates to the field of circuit boards, and in particular to multilayer circuit boards and connectors including the same. Background technique [0002] It is generally known that signals traveling through transmission lines, especially high frequency signals, can suffer from insertion loss. The magnitude of insertion loss depends on the signal frequency, transmission line dimensions, and material properties. The magnitude of insertion loss is usually expressed in units of dB loss, 0dB means no loss, -6dB means a loss of 2 times compared to the incident value, and -20dB means a loss of 10 times. A signal transmitted over a transmission line having a first portion of one geometry bordering a second portion of another geometry may suffer significant loss at the interface between the first portion and the second portion. [0003] It is also generally known that transmission lines arranged close to each other may exhibit signal cros...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H01R13/6461
CPCH05K3/429H05K2201/09618H05K1/0245H05K2201/0187H05K1/024H05K2201/09063H05K2201/10189H05K2201/09636H01R13/646H05K1/0251H05K2201/09718H05K1/115
Inventor J·德格斯特S·H·J·塞尔屈
Owner FRAMATOME CONNECTORS INT SA
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