Target usage detection system and method

Abstract

The invention relates to the technical field of sputter coating, and particularly relates to a target usage detection system and method, which are used for preventing targets from being used excessively so as to improve the qualified rate of products in a sputter coating procedure. The invention discloses a target usage detection system comprising a target, a flowmeter and a self-locking device of sputtering equipment, wherein at least one boss with a groove and an air guide channel communicated with the groove are arranged on a back plate of the target, and a notch of the groove is sealed by a target embry of the target and a connection part; the flowmeter is communicated with the air guide channel and used for monitoring whether air in the air guide channel and the groove flows or not; and the self-locking device of the sputtering equipment is in signal connection with the flowmeter and used for acquiring the state of the flowmeter, and when the flowmeter shows a flow, the self-locking device starts so that the sputtering equipment stops working.

Description

technical field [0001] The invention relates to the technical field of sputter coating, in particular to a target use detection system and method. Background technique [0002] Sputtering coating is a process in which high-purity target atoms in the target are bombarded by high-energy ion beams and deposited on the substrate; figure 1 , figure 2 As shown, the existing target generally includes: a back copper plate 10 with a fixing hole 11, a high-purity target 20 and a connection portion 30 that fixes the high-purity target 20 on the back copper plate 10; during the sputtering coating process, As the high-purity target 20 atoms are continuously bombarded, the high-purity target 20 is gradually consumed; due to the particularity of the sputtering coating process, in figure 2 The high-purity target material 20 in the two areas of A and B consumes the fastest, that is, the high-purity target material 20 is most likely to be sputtered through in the two areas of A and B, whi...

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Problems solved by technology

[0002] Sputtering coating is a process in which high-purity target atoms in the target are bombarded by high-energy ion beams and deposited on the substrate; figure 1 , figure 2 As shown, the existing target generally includes: a back copper plate 10 with a fixing hole 11, a high-purity target 20 and a connection portion 30 that fixes the high-purity target 20 on the back copper plate 10; during the sputtering coating process, As the high-purity target 20 atoms are continuously bombarded, the high-purity target 20 is gradually consumed; due to the particularity of the sputtering coating process, in figure 2 The high-purity target material 20 in the two areas of A and B consumes the fastest, that is, the high-purity target material 20 is most likely to be sputtered through in the two areas of A and B, which requires timely replacement of the target material, otherwise Excessive use of the target will cause the copper atoms on the back copper plate to be sputtered out and deposited on the substrate, thus affecting the performance of the coated film

[0003] However, in the current sputtering coating process, the method of setting the target life value is usually used to prevent excessive use of the target material, and the target life value is usually obtained from experience. Excessive problem, which affects the pass rate of products in the sputtering coating process

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