Polarization-reinforced p-i-n junction InGaN solar cell
A p-i-n, solar cell technology, applied in the field of solar cells, can solve the problems of lower solar cell conversion efficiency, lower cell conversion efficiency, lower cell efficiency, etc., achieve low recombination probability, reduce the number and the generation of dislocations, and improve the conversion efficiency. Effect
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Embodiment 1
[0019] see figure 1 , the structure of the p-i-n junction InGaN solar cell of this embodiment includes from bottom to top: Si substrate 1, GaN layer 2, fully strained relaxed In y Ga 1-y N layer 3, InGaN superlattice layer 4, high In composition n-In y Ga 1-y N layer 5, high In composition i-In x Ga 1-x N layer 7, high In composition p-In y Ga 1-y N layer 8 , p-GaN layer covering layer 9 . Among them, the thickness of GaN layer 2 is 1000nm; full strain relaxation In y Ga 1-y The thickness of N layer 3 is 1000nm, y is 0.5; InGaN superlattice layer 4 contains 10 periods of In 0.5 Ga 0.5 N / GaN heterojunction, where In in each period 0.5 Ga 0.5 N layer on top, GaN on bottom, In in each cycle 0.5 Ga 0.5 N and GaN thickness are both 5nm; high In composition n-In y Ga 1-y The thickness of N layer 5 is 1000nm, y is 0.5, high In composition i-In x Ga 1-x The thickness of N layer 7 is 100nm, x is 0.3; high In composition p-In y Ga 1-y The thickness of the N layer 8 i...
Embodiment 2
[0021] The structure of this embodiment is basically the same as that of Embodiment 1, the difference is that the full strain relaxation In y Ga 1-y The thickness of N layer 3 is 500nm; InGaN superlattice layer 4 contains 5 periods of In 0.5 Ga 0.5 N / GaN heterojunction, where In in each period 0.5 Ga 0.5 Both N and GaN thickness are 1nm; high In composition n-In y Ga 1-yThe thickness of N layer 5 is 300nm, high In composition i-In x Ga 1-x The thickness of N layer 7 is 30nm; high In composition p-In y Ga 1-y The thickness of the N layer 8 is 50nm; the thickness of the p-GaN layer 9 is 10nm; the width of each electrode of the grid-shaped positive electrode 10 is 50nm, the electrode spacing is 500nm, and the thickness is 30nm; the electrode size of the negative electrode 6 is 0.3×0.3 mm 2 , with a thickness of 100nm.
Embodiment 3
[0023] The structure of this embodiment is basically the same as that of Embodiment 1, the difference is that the full strain relaxation In y Ga 1-y The thickness of N layer 3 is 800nm; InGaN superlattice layer 4 contains 3 periods of In 0.5 Ga 0.5 N / GaN heterojunction, where In in each period 0.5 Ga 0.5 N and GaN thickness are both 3nm; high In composition n-In y Ga 1-y The thickness of N layer 5 is 600nm, high In composition i-In x Ga 1-x The thickness of N layer 7 is 60nm; high In composition p-In y Ga 1-y The thickness of the N layer 8 is 100nm; the thickness of the p-GaN layer 9 is 20nm; the width of each electrode of the grid-shaped positive electrode 10 is 100nm, the electrode spacing is 1000nm, and the thickness is 100nm; the electrode size of the negative electrode 6 is 0.6×0.6 mm 2 , with a thickness of 200nm.
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