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Transparent conductive film

A technology of transparent conductivity and transparent conductor, applied in the direction of conductive layer, circuit, printed circuit, etc. on insulating carrier

Active Publication Date: 2013-04-10
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, there are still cases where the transparent conductive pattern is recognized in the conventional transparent conductive film (ideally, the transparent conductive pattern is not recognized at all)

Method used

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  • Transparent conductive film
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Examples

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Embodiment 1

[0048] A primer layer (thickness 30 nm) of a thermosetting resin containing melamine resin was formed on a polyethylene terephthalate film having a thickness of 23 μm, and the film substrate 11 was prepared. The roll of the film substrate 11 is set in a sputtering device. The atmosphere in the sputtering device is a pressure of 0.4 Pa, and the specific composition of the gas is 80% by volume of argon and 20% by volume of oxygen. While unwinding the roll of the film substrate 11 at a certain speed, the first amorphous layer of indium tin oxide and the second amorphous layer of indium tin oxide are sequentially formed on the film substrate 11 to form a thickness of 20 nm Transparent conductor film. For the first amorphous layer of indium tin oxide, the content of tin oxide is 10% by weight and the thickness is 8 nm. For the second amorphous layer of indium tin oxide, the content of tin oxide is 3.3% by weight and the thickness is 12 nm. The film substrate 11 on which the first...

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Abstract

There is provided a transparent conductive film (10) which comprises: a film substrate (11); a plurality of transparent conductor patterns (12) formed on the film substrate (11); and a pressure-sensitive adhesive layer (13) wherein the transparent conductor patterns (12) are embedded. The plurality of transparent conductor patterns (12) respectively have a two-layer structure wherein a first indium tin oxide layer (14) and a second indium tin oxide layer (15) are laminated on the film substrate (11) in this order, and the first indium tin oxide layer (14) has a greater tin oxide content than the second indium tin oxide layer (15) does. The first indium tin oxide layer (14) has a smaller thickness than the second indium tin oxide layer (15) does.

Description

Technical field [0001] The present invention relates to a transparent conductive thin film using an indium tin oxide (ITO: Indium Tin Oxide) film. Background technique [0002] A transparent conductive film having a film base material, a transparent conductor pattern, and a filling material is known (Patent Document 1: Japanese Patent Publication 2007-508639). The film substrate has a coating layer formed of silica or the like. The transparent conductor pattern is formed on the coating. The filling material is formed on the film substrate by embedding the transparent conductor pattern. The transparent conductor pattern is typically formed of an indium tin oxide (ITO: Indium Tin Oxide) film. Such a transparent conductive film is applied to a capacitive touch panel, for example, and has a characteristic that the transparent conductive pattern is difficult to be recognized. However, in the conventional transparent conductive film, the transparent conductor pattern may still be r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B5/14H01B1/08
CPCG06F3/044G06F2203/04103H01L31/1884H05K1/09H05K2201/0326H01B1/08H01B5/14G06F3/041H05K1/0274Y02E10/50
Inventor 梨木智刚拝师基希野口知功石桥邦昭梶原大辅
Owner NITTO DENKO CORP
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