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Backplate for microphone

A microphone and backplane technology, applied in the field of microphones, to achieve the effect of improving the signal-to-noise ratio

Inactive Publication Date: 2013-04-10
KNOWLES ELECTRONICS ASIA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Achieving all of these features in a microphone with dimensions smaller than 1 mm using integrated circuit materials has been challenging

Method used

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  • Backplate for microphone
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Embodiment Construction

[0023] The present invention will be described with respect to particular embodiments and with reference to certain drawings but the invention is not limited thereto but only by the claims. The drawings described are illustrative only and not limiting. In the drawings, the size of some of the elements is exaggerated and not drawn on scale for illustrative purposes. Where the term "comprising" is used in the present description and claims, it does not exclude other elements or steps. Where an indefinite or definite article is used when referring to a singular noun eg "a" or "an", "the", this includes a plural of that noun unless something else is specifically stated.

[0024] The term "comprising", used in the claims, should not be interpreted as limiting to the means listed thereafter. It does not exclude other elements or steps. Therefore, the scope of the expression "a device including means A and B" should not be limited to a device including parts A and B only. It mean...

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Abstract

A microphone has a membrane (20) mounted to vibrate in response to pressure fluctuations, a backplate (30) facing the membrane and being more rigid than the membrane, and circuitry (95) for sensing the vibrations relative to the backplate, the backplate being prestressed and having a geometry such that a response of the backplate to structure borne vibration matches a corresponding response of the membrane. This can help reduce or minimize relative movement between these surfaces caused by structure borne vibration and hence improve the signal-to-noise ratio of the microphone. The geometry can be a hub and spoke arrangement.

Description

technical field [0001] The present invention relates to microphones, packages or devices having such microphones and their corresponding design or manufacturing methods. Background technique [0002] In many systems with microphones, such as cell phones, there is a need to reduce size and reduce manufacturing costs. Microphone-related electronics include preamplifiers (for high-impedance capacitive transducers), bias circuits (at least for electret-type microphones) , A / D converter, and signal processing. PCB mounting is usually preferred for cell phone manufacturers, in line with existing high-speed assembly lines. Commonly used electret microphones do not have the form factor required for integration with their associated electronics. Known MEMS-type microphones can be used, as discussed in "the top ten reason for using MEMS in cell phones" In-Stat MDR, September 2003. One advantage is that such MEMS-type microphones are less sensitive to less sensitive to damage. [000...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/00H04R31/00B81C1/00
CPCH04R19/005H04R31/00H04R2499/11Y10T29/49005Y10T29/49575
Inventor 卡斯·范·德·阿沃尔特安德瑞斯·伯纳德斯·詹斯曼格特·兰格雷斯特温·范利庞希尔柯·瑟伊
Owner KNOWLES ELECTRONICS ASIA