High-brightness light-emitting diode (LED) chip carrier structure with powerful heat dissipation function

Abstract

The invention discloses a high-brightness light-emitting diode (LED) chip carrier structure with a powerful heat dissipation function. The high-brightness LED chip carrier structure comprises a heat sink, electrodes, a packaging colloid used for packaging the heat sink and the electrodes into a whole, and colloidal silica, wherein a downwards recessed radiating area is formed in the center of the heat sink; an LED chip is fixed on the upper surface of the radiating area; the packaging colloid is filled in a gap between the heat sink and the electrode and between the electrodes, so that the heat sink and the electrodes are separated to form insulation; the lower surface of the radiating area of the heat sink and one end of each electrode far away from the heat sink are exposed outside the packaging colloid; and a reflecting hole with larger top and smaller bottom is formed above the LED chip through the packaging colloid. The lower surface of the radiating area of the heat sink is exposed outside the packaging colloid, so that the LED chip carrier structure has a good heat dissipation effect; and moreover, because radiating limitation is avoided, a high-power LED chip can be used in the carrier structure, and high brightness is obtained.

Description

technical field [0001] The invention relates to an LED chip carrier structure, in particular to a high-brightness LED chip carrier structure with a strong heat dissipation function. Background technique [0002] At present, many LED chips are due to the imperfect structure of the carrier, which leads to their own absolute advantages that cannot be accepted by the market. The existing carrier structure often has the following defects: 1. Insufficient light output leads to the super energy saving of the LED chip itself. 2. The poor heat dissipation effect leads to the life of the LED chip of more than 100,000 hours, which is often damaged due to the high junction temperature of the chip; 3. Poor air tightness leads to the penetration of oxygen and moisture in the air So that the chip is oxidized and decayed. [0003] At present, there is still no LED chip carrier structure that can effectively improve brightness, enhance heat dissipation, and have good airtightness. Content...

AI Technical Summary

Problems solved by technology

[0002] At present, many LED chips are due to the imperfect structure of the carrier, which leads to their own absolute advantages that cannot be accepted by the market. The existing carrier structure often has the following defects: 1. Insufficient light output leads to the super energy saving of the LED chip itself. 2. The poor heat dissipation effect leads to the life of the LED chip of more than 100,000 hours, which is often damaged due to the high junction temperature of the chip; 3. Poor air tightness leads to the penetration of oxygen and moisture in the air So that the chip is oxidized and decayed

[0003] At present, there is no LED chip carrier structure that can effectively improve brightness, enhance heat dissipation and have good airtightness

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