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Production method of photosensitive resin and photosensitive resin composition

A technology of photosensitive resin and manufacturing method, which is applied in the field of photosensitive resin manufacture and photosensitive resin composition, can solve problems such as catalyst residue, substrate metal corrosion, resin hue, acid value change, etc., achieve stable electrical characteristics, simplify Excellent effect of manufacturing process and PCT resistance

Active Publication Date: 2014-10-01
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these photosensitive resins use catalysts such as strong acids when introducing unsaturated monocarboxylic acids, so they are highly corrosive to metals such as stainless steel, so the selection range of materials that can be used to manufacture devices is narrow, resulting in increased equipment costs.
In particular, if metal components generated by corrosion are mixed into the resin, it will have a large adverse effect on reliability as a solder resist such as electrical insulation
Moreover, when these strong acid catalysts are used, complicated catalyst removal processes such as neutralization, water washing, or adsorption treatment are required after the reaction, resulting in a large amount of waste
In particular, even if neutralization and cleaning are performed, the catalyst will remain, which will easily change the hue and acid value of the resin over time, and easily corrode the metal on the substrate
Although Patent Document 2 describes the introduction of a polymerizable unsaturated group using an unsaturated group-containing carboxylic acid ester, the esterification catalyst is also a strongly acidic compound and is not intended to solve the above-mentioned problems.

Method used

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  • Production method of photosensitive resin and photosensitive resin composition
  • Production method of photosensitive resin and photosensitive resin composition
  • Production method of photosensitive resin and photosensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] A novolak-type cresol resin (trade name "Shonol BRG-556") manufactured by Showa High Polymer Co., Ltd. and ring 239 parts of resins having alcoholic hydroxyl groups reacted with ethylene oxide (hydroxyl groups: 239 g / eq., an average of 3.0 moles of alkylene oxide added per 1 equivalent of phenolic hydroxyl groups), 600 parts of methyl methacrylate, Zirconium tetrapentadionate (Zr(acac) 4 ) and 0.2 parts of methylhydroquinone as a polymerization inhibitor, and the reaction was carried out at 100° C. while introducing dry air (50 ml / min). After the start of the reaction, the reaction was carried out for 7 hours while distilling off the generated methanol together with methyl methacrylate from the reaction system. 30 parts of diethylene glycol monoethyl ether acetate were added, and excess methyl methacrylate and methanol were removed by vacuum distillation to obtain a methacrylic group-introduced resin solution. Furthermore, this resin was made to react with 61 parts of...

Embodiment 2

[0055] A methacrylic group-introduced resin solution was obtained in the same manner except that toluene was used instead of diethylene glycol monoethyl ether acetate in Example 1. 6 parts of acetic acid were added to the obtained solution, and it stirred at 40 degreeC for 10 minutes. Next, after washing with water three times, toluene was replaced by 30 parts of diethylene glycol monoethyl ether acetate and distilled off to obtain a methacrylic group-introduced resin solution. Furthermore, this resin was made to react with 61 parts of tetrahydrophthalic anhydrides (0.4 equivalent with respect to alcoholic hydroxyl group), and the curable resin solution which has developability was obtained. The same evaluation as in Example 1 was performed, and the results are shown in Table 1.

Embodiment 3

[0057]In a reaction device made of SUS equipped with a stirrer, a cooling pipe, a thermometer, and an air introduction pipe, a novolak-type cresol resin (trade name "Shonol (シヨウノール) CRG-951" manufactured by Showa High Polymer Co., Ltd.) was placed. ) with propylene oxide reacted with alcoholic hydroxyl resin (hydroxyl group: 386g / eq., per 1 equivalent of phenolic hydroxyl group, an average of 5.0 moles of alkylene oxide added) 386 parts, ethyl acrylate 500 parts, bis Zinc glutarionate (Zn(acac) 2 ) and 0.3 parts of methyl hydroquinone as a polymerization inhibitor were reacted at 100° C. while introducing dry air (50 ml / min). After the reaction started, the resulting ethanol was distilled out of the reaction system together with ethyl acrylate, and reacted for 5 hours. Add 50 parts of diethylene glycol monoethyl ether acetate, carry out vacuum distillation, and remove excess ethyl acrylate and ethanol, thereby obtaining a resin solution through which acrylic acid groups have ...

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Abstract

The object of the present invention is to provide a production of a photosensitive resin that reduces the content of chlorine and metal corrosion components in order to achieve high reliability of printed circuit boards, and is excellent in the required properties such as the adhesion of the cured film. method. The method for producing a photosensitive resin of the present invention is characterized in that, in the presence of an acetylacetone complex (d) of zinc or zirconium, a carboxylic acid ester (c) containing a polymerizable unsaturated group is introduced into one molecule In the resin (b) in which part or all of the phenolic hydroxyl groups of the resin (a) having two or more phenolic hydroxyl groups is chain-extended with a (poly)oxyalkylene group having an alcoholic hydroxyl group at the end, the polymerizability is not The saturated group is in the range of 0.2 to 0.8 equivalents with respect to 1 equivalent of the alcoholic hydroxyl group of resin (b), and furthermore, the remaining alcoholic hydroxyl group is made to react with polybasic acid anhydride (e).

Description

technical field [0001] The present invention relates to a method for producing a photosensitive resin and a photosensitive resin composition containing the resin. The method for producing the photosensitive resin is to convert the phenolic hydroxyl group of a resin having a phenolic hydroxyl group into a (poly)oxyalkylene group ( Polyoxyalkylene) is subjected to a transesterification reaction between the chain-extended resin and a carboxylic acid ester containing a polymerizable unsaturated group, and the polymerizable unsaturated group is introduced in the presence of an acetylacetone complex of zinc or zirconium, and the A method of reacting the obtained reaction product with polybasic acid anhydride. Background technique [0002] In recent years, along with the miniaturization, weight reduction, and high performance of electronic equipment on printed circuit boards, the demand for solder resist on the circuit itself used to cover the printed circuit board has gradually in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G8/28C08L63/00G03F7/027
CPCC08L61/04G03F7/032C08L63/00G03F7/038C08K5/10C08G8/28G03F7/027
Inventor 坂本淳上井浩志小川幸志小林将行西口将司
Owner RESONAC CORPORATION
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