Photosensitive resin composition, cured product thereof, and method for producing photosensitive resin

A technology of photosensitive resin and composition, applied in the field of photosensitive resin composition and photosensitive resin cured product, to achieve the effect of excellent photosensitivity

Active Publication Date: 2013-01-02
TOYO INK SC HOLD CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Photosensitive solder resists currently on the market cannot adequately meet these requirements

Method used

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  • Photosensitive resin composition, cured product thereof, and method for producing photosensitive resin
  • Photosensitive resin composition, cured product thereof, and method for producing photosensitive resin
  • Photosensitive resin composition, cured product thereof, and method for producing photosensitive resin

Examples

Experimental program
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Embodiment

[0226] Hereinafter, the present invention is further described in detail through examples, but the following examples do not limit the protection scope of the present invention in any way. In the examples, "parts" means "parts by weight".

[0227] On the other hand, the measurement conditions of GPC are as follows.

[0228] Determination of weight average molecular weight (Mw)

[0229] The measurement of Mw used GPC (Gel Permeation Chromatography) "HPC-8020" manufactured by TOSOH Co., Ltd. GPC is a liquid chromatography method for separating and quantifying substances dissolved in a solvent (THF; tetrahydrofuran) according to the difference in molecular size. In the measurement of the present invention, the column used is two "LF-604" connected in series (manufactured by Showa Denko Co., Ltd.: GPC column for rapid analysis: 6mmID × 150mm size), with a flow rate of 0.6ml / min, the column It performed under the condition of a temperature of 40 degreeC, and the determination of...

manufacture example 1

[0234] 64.8 parts of bisphenol A and 57.1 parts of YD8125 (manufactured by Nippon Steel Chemical Co., Ltd., bisphenol A type epoxy compound) were added to a 4-neck flask equipped with a stirrer, a reflux cooling pipe, a nitrogen gas introduction pipe, an introduction pipe, and a thermometer. 128.1 parts of EX861 (manufactured by NAGASECHEMTEX Co., Ltd.: polyethylene glycol diglycidyl ether), 1.25 parts of triphenylphosphine as a catalyst, 1.52 parts of N,N-dimethylbenzylamine, 250 parts of toluene as a solvent , under a nitrogen stream, the temperature was raised to 110° C. while stirring, and the reaction was carried out for 8 hours to obtain a hydroxyl group-containing resin. Then, 54.6 parts of RIKACID SA (manufactured by Nippon Chemical Co., Ltd.: succinic anhydride) was added as an acid anhydride, and it was further reacted at 110°C for 4 hours. After confirming that the absorption of the acid anhydride group disappeared by FT-IR measurement, it cooled to room temperature...

manufacture example 2～8

[0236] The hydroxyl group-containing photosensitive resin (A-1) of manufacture examples 2-8 was obtained by performing the same operation as manufacture example 1 using the raw material shown in Table 1. On the other hand, in Table 1, the parts by weight of the compounds used are shown immediately below the compounds. The same applies to the tables described later.

[0237] Synthesis of Carboxyl-containing Photosensitive Resin (A-2)

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PUM

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Abstract

The invention provides a photosensitive resin composition, a cured film of which has excellent flexibility, insulativity, adhesiveness, etc., and is quite suitable to be used as a photosensitive anti-soldering agent. The composition comprises a photosensitive resin (A); at least one compound selected from a compound containing an epoxy group, a non-block isocyanate compound, a block isocyanate compound and a compound containing a beta-hydroxyalkylamide; and a photopolymerization initiator. The photosensitive resin (A) is prepared in the following ways, in which a resin (c) containing a hydroxyl group on a side chain is prepared by using an epoxy compound (a) having at least two epoxy groups in one molecule and a phenolic compound (b) having at least two phenolic hydroxyl groups in one molecule, then a resin (e) containing a carboxyl group is prepared by using the resin (c) and a polybasic anhydride (d), and then the photosensitive resin (A) is prepared by using the resin (e) and an epoxy group or an oxetane group in a compound (f) having the epoxy group or the oxetane group and having a vinyl unsaturated group.

Description

technical field [0001] The present invention relates to a photosensitive resin composition containing a photosensitive resin used for printed wiring boards, a cured photosensitive resin, and a method for producing the photosensitive resin. Moreover, it is related with the photosensitive solder resist ink containing the said photosensitive resin, and a dry film type photosensitive solder resist. Background technique [0002] In order to protect the wiring (circuit) pattern formed on the substrate from the external environment and the soldering process when electronic components are mounted on the surface of the printed circuit board, in order to protect unnecessary parts from adhering to solder, the A protective layer called cover film or solder mask is applied to the printed circuit board. In the past, since rigid printed circuit boards were the mainstream, in addition to pattern accuracy, adhesion to the substrate and heat resistance were mainly required for the cured prot...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/00C09D11/10C08F299/02C08G59/17G03F7/027H05K3/28
CPCY02T10/7072G03F7/004G03F7/0045G03F7/027G03F7/032G03F7/20G03F7/2002
Inventor 荻原直人桑原章史松户和规秦野望阪口豪滨田直宏早川纯平宫本彩子
Owner TOYO INK SC HOLD CO LTD
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