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Metal base circuit board, and method for producing metal base circuit board

A technology for circuit substrates and manufacturing methods, which is applied in the manufacture of metal core circuits, circuit substrate materials, and printed circuit manufacturing, etc., can solve the problems of reduced adhesion of insulating resin layers, etc., and achieve the effects of excellent bending resistance and improved yield.

Inactive Publication Date: 2013-09-04
SUMITOMO BAKELITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When an oxide film is formed on the surface of the metal substrate constituting the metal base circuit board, the adhesion to the insulating resin layer is reduced

Method used

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  • Metal base circuit board, and method for producing metal base circuit board
  • Metal base circuit board, and method for producing metal base circuit board
  • Metal base circuit board, and method for producing metal base circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1）

[0151] In addition, in the following Example 1, when resin varnish a was used, it was marked with "Example 1a", and when resin varnish b was used, it was marked with "Example 1b". The same applies to other Examples and Comparative Examples.

[0152] (production of resin paint a)

[0153] A phenoxy resin having a bisphenol F skeleton and a bisphenol A skeleton (manufactured by Mitsubishi Chemical Corporation, 4275, with a weight average molecular weight of 6.0×10 4 , ratio of bisphenol F skeleton to bisphenol A skeleton=75:25) 22.0 parts by mass, bisphenol F epoxy resin (manufactured by DIC Corporation, 830S, epoxy equivalent 170) 10.0 parts by mass, bisphenol A epoxy resin ( Mitsubishi Chemical Corporation, 1001, epoxy equivalent 475) 15.0 parts by mass, 2-phenylimidazole (2PZ manufactured by Shikoku Chemicals Co., Ltd.) 1.0 parts by mass, γ-glycidoxytrimethylsilane as a silane coupling agent ( KBM-403 (manufactured by Shin-Etsu Silicone Co., Ltd.) 2.0 parts by mass, aluminu...

Embodiment 2～5 and comparative example 1～8）

[0159] The aluminum plate was treated according to the treatment conditions in Tables 1-3, washed with acetone, and dried to obtain an aluminum test plate.

[0160] (reference example)

[0161] An aluminum plate with a thickness of 1 mm and an aluminum plate of 10 cm in width and height was used as a substrate. The surface of the substrate was polished with sandpaper (#1500), washed with acetone, and dried to obtain an aluminum test panel.

Embodiment 6～8）

[0163] An aluminum plate with a thickness of 1 mm and an aluminum plate of 10 cm in width and height was used as a substrate. As the ultraviolet irradiation device, a low-pressure mercury lamp (manufactured by OAK Corporation, wavelength: 185nm, radiation intensity 5.0mW / cm was used) 2 ). One side of the substrate was irradiated with ultraviolet light according to the treatment conditions in Table 4 to obtain an aluminum test plate.

[0164] Each of the following evaluations was performed by the following measuring method about the aluminum test plate obtained from each Example, the comparative example, and the reference example. The evaluation results are shown in Tables 1 to 4. The relationship between contact angle and adhesion strength is as follows: image 3 shown. In addition, the relationship between processing conditions and adhesion strength is as follows: Figure 4 shown.

[0165] a. Contact angle with water

[0166] According to JIS R3257, the average of 5 po...

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Abstract

A metal base circuit board (10) is laminated with an aluminum substrate (12), an insulating resin layer (14), and a metal layer (16) in said order. The surface of the aluminum substrate (12) is brought into contact with water having a temperature of 50 to 80 DEG C for 0.5 to 3 minutes such that the surface roughness (Rz) of the surface of the aluminum substrate (12) is between 3 and 9 [mu]m and the water contact angle thereof is between 50 DEG and 95 DEG .

Description

technical field [0001] The invention relates to a metal-based circuit substrate and a method for manufacturing the metal-based circuit substrate. Background technique [0002] Conventionally, metal base circuit boards in which metal layers are laminated on an aluminum substrate with an insulating resin layer interposed therebetween have been used for the purpose of releasing heat emitted from mounted components. [0003] When an oxide film is formed on the surface of the metal substrate constituting the metal base circuit board, the adhesion to the insulating resin layer is reduced. Therefore, as described in Patent Documents 1 and 2, in order to remove the oxide film on the surface of the aluminum substrate, mechanical polishing is performed to polish the surface, and as described in Patent Documents 3 to 5, the surface is roughened by chemical etching. . [0004] In addition, in recent years, light-emitting elements such as LEDs have been mounted and used as light source...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/05H05K3/44
CPCH05K1/056H05K3/385H05K2201/0209H05K2203/0307H05K2203/0315H05K1/05H05K3/44
Inventor 白土洋次武谷光男马场孝幸飞泽晃彦
Owner SUMITOMO BAKELITE CO LTD
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