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Curable resin comosition and coating film thereof

A technology of curable resin and composition, applied in the direction of coating, coating non-metallic protective layer, instruments, etc., can solve the problem of difficulty in imparting flame retardancy to polyimide, poor adhesion of polyimide, and electroplating resistance. PCT-resistant solder reduces heat resistance and other problems, and achieves the effects of excellent flexibility, excellent electrical insulation, and low hydrolysis

Inactive Publication Date: 2005-10-12
TAIYO INK MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] As such a heat-curable solder resist ink, there is an epoxy resin-based solder resist ink composition (refer to Patent Document 4) containing an epoxy resin and a dibasic acid anhydride as essential components. When softness is imparted to the coating film, the adhesive force between polyimide and the base material deteriorates, and there is a problem that plating resistance, PCT (pressure cooker test) resistance, and solder heat resistance decrease
In addition, there is a problem that it is difficult to impart flame retardancy like polyimide

Method used

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  • Curable resin comosition and coating film thereof
  • Curable resin comosition and coating film thereof
  • Curable resin comosition and coating film thereof

Examples

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Embodiment

[0148] The following examples and comparative examples are given to describe the present invention in detail, but the present invention is of course not limited to the following examples. In addition, the following "parts" and "%" are all based on weight unless otherwise indicated.

Synthetic example 1

[0150] Synthesis Example 1 Synthesis of carboxyl-containing photosensitive resin (A-1)

[0151] Measure 210 parts of cresol novolak type epoxy resins (EPICLON N-680, Dainippon Ink Chemical Industry Co., Ltd. manufactures, epoxy equivalent=210) and 109.7 parts of carbitol acetate, in equipped with thermometer, stirrer, Heat to dissolve in the flask with dropping funnel and reflux condenser. Next, 0.1 part of hydroquinone as a polymerization inhibitor and 2.0 parts of triphenylphosphine as a reaction catalyst were added. The mixture was heated to 95-105° C., 72 parts of acrylic acid was slowly added dropwise, and reacted for about 16 hours until the acid value was 3.0 mgKOH / g or less. Cool the reaction product to 80-90°C, add 76.1 parts of tetrahydrophthalic anhydride, and react for about 6 hours until the absorption peak of the anhydride (1780cm -1 ) until it disappears. To this reaction liquid, 109.7 parts of aromatic solvent IPSOL#150 manufactured by Idemitsu Petrochemi...

Synthetic example 2

[0152] Synthesis example 2 Synthesis of carboxyl-containing photosensitive resin (A-1)

[0153] In a flask equipped with a stirring device, a condenser and a thermometer, 380 parts of bisphenol F type epoxy resin (epoxy equivalent = 950, softening point 85 ° C, average degree of polymerization n = 6.2) and 925 parts of epoxy chlorine After dissolving propane in 462.5 parts of dimethyl sulfoxide, 60.9 parts (1.5 mol) of sodium hydroxide with a purity of 98.5% was added under stirring at 70° C. for 100 minutes. After the addition, it was further reacted at 70° C. for 3 hours. After completion of the reaction, 250 parts of water were added for water washing. After the oil-water separation, under reduced pressure, distill and reclaim most of the dimethyl sulfoxide and excess unreacted epichlorohydrin from the oil layer, and contain the reaction product of residual by-product salt and dimethyl sulfoxide in 750 parts of methyl It was dissolved in isobutyl ketone, and 10 parts ...

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Abstract

The present invention provides a cured resin composition having low hydrolyzability and halogen-free stable flame-resistance, excellent in solder heat-resistance, chemical resistance, adhesiveness, electric insulation and the like. The invention further provides a cured resin composition and a cured film thereof for a carrier tape and a flexible print circuit board, excellent in flexing resistance and causing little warpage after curing. The photosetting / thermosetting resin composition and the thermosetting composition are useful for a solder resist for print circuit boards, which are characterized in: containing a phosphate acidamine compound. Further, a cured film having the resin composition is also provided.

Description

technical field [0001] The present invention relates to a halogen-free and flame-retardant curable resin composition useful as a solder resist ink used in the manufacture of printed wiring boards and tape carrier packages. More specifically, it relates to solder resist inks used in printed circuit boards, or as solder resist inks used in TAB (tape automated bonding), CSP (chip size package: Chip Size Package), TCP (tape carrier package) : Semiconductor carrier tape used in Tape Carrier Package) and COF (Chip on Film: Chip on Film) and other useful curable resin composition and its cured coating film, the resin composition has low hydrolysis, It is excellent in solder heat resistance, chemical resistance, adhesion, electrical insulation, etc., and is halogen-free and has stable flame retardancy. Background technique [0002] In general, as a solder resist for printed wiring boards, from the viewpoint of high precision and high density, the following solder resists are widely...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K5/5399C09D201/02G03F7/027H05B3/32
CPCC08G59/42C08K5/5399C08L63/00H05K3/28
Inventor 森野博满三由忠大
Owner TAIYO INK MFG CO LTD
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