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Porefilling heat curing resin composition

A resin composition and thermosetting technology, applied in the direction of circuit substrate materials, printed circuit components, etc., can solve the problems of PCT resistance decline, printed circuit board insulation reliability deterioration, etc., and achieve small change rate of thermal expansion rate, high density Excellent compatibility and high glass transition point

Active Publication Date: 2012-05-30
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, as described above, in the case of using an epoxy resin composition different from that for solder resist for hole filling of printed wiring boards, under high temperature conditions such as curing treatment and solder leveling, such as figure 2 As shown, there are cracks in the hole insulating layer 5 (internal crack Y), and peeling (delamination X) between the peripheral portion of the hole insulating layer 5 and the outer insulating layer 6 (solder resist or insulating resin layer). question
When such cracks and delaminations occur, the PCT resistance (pressure cooker test resistance) under high temperature and high humidity will decrease, and the insulation reliability of the printed wiring board will deteriorate.

Method used

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  • Porefilling heat curing resin composition
  • Porefilling heat curing resin composition
  • Porefilling heat curing resin composition

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Embodiment 1～7

[0108] The components listed in the following Table 1 were blended in the ratio shown in Table 1, pre-mixed, and then kneaded and dispersed with a 3-roll mill to obtain a thermosetting resin composition for hole filling. The multifunctional epoxy resin in Table 1 refers to the epoxy resin with more than 3 functional groups.

[0109] Table 1

[0110]

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Abstract

The present invention provides a porefilling heat curing resin composition, a combined unit with photo-curing heat curing resin composition for forming solder mask, and a printed circuit board using these. The heat curing resin composition for stuffing hole parts of the printed circuit board is a heat curing resin composition which contains epoxy resin, epoxy curing agent and inorganic filler andis stuffed in the hole part of the printed circuit board, which is characterized in that the epoxy resin contains epoxy resin with two functional groups and epoxy resin with more than three functionalgroup, the inorganic filler contains periodic table IIa family elemental salts. In addition, in the combined unit using the porefilling heat curing resin composition, the photo-curing heat curing resin composition II for forming solder mask contains a light polymerization initiator with the decomposition temperature more than 250 DEG C.

Description

technical field [0001] The present invention relates to a thermosetting resin composition for hole filling, a combination unit of the composition and a photocurable thermosetting resin composition for solder resist formation, and a printed wiring board. Specifically, it relates to a liquid thermosetting resin composition useful as a composition for permanently filling through holes, via holes, etc. in printed wiring boards such as multilayer substrates and double-sided substrates , and a combined unit of the composition and a photocurable thermosetting resin composition for solder resist formation, and a printed circuit for permanent filling of through holes and via holes and solder resist formation using the composition or the combined unit plate. [0002] In addition, in this specification, a "hole part" is a term which collectively names through-holes, via holes, and the like formed during the production process of a printed wiring board. Background technique [0003] A...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K3/10H05K1/03
Inventor 远藤新柴田大介邑田胜人
Owner TAIYO HLDG CO LTD
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