Photo-curable thermosetting resin composition, photo-curable thermosetting film, condensate, and printed circuit board including condensate

A resin composition, thermosetting technology, applied in the direction of printed circuit, printed circuit manufacturing, printed circuit secondary treatment, etc., to achieve the effect of excellent electrical insulation and excellent operability

Active Publication Date: 2014-09-24
TAIYO HLDG CO LTD +1
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the carboxyl group-containing resins used in these existing solder resist compositions have poor electrical characteristics

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Photo-curable thermosetting resin composition, photo-curable thermosetting film, condensate, and printed circuit board including condensate
  • Photo-curable thermosetting resin composition, photo-curable thermosetting film, condensate, and printed circuit board including condensate
  • Photo-curable thermosetting resin composition, photo-curable thermosetting film, condensate, and printed circuit board including condensate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1~6

[0273] The performance evaluation and property evaluation of the composition of the Example and the comparative example shown in Table 1 were performed by the evaluation method shown below. The evaluation results are shown in Table 2.

[0274] Performance evaluation:

[0275]

[0276] A circuit pattern substrate with a copper thickness of 18 μm was subjected to a copper surface roughening treatment (Mec etch Bond CZ-8100 manufactured by Mec Corporation), washed with water, dried, and then coated with the substrates shown in Table 1 on the entire surface by the screen printing method. The compositions of Examples and Comparative Examples were dried in a hot air circulation drying oven at 80° C. for 60 minutes to obtain a dry coating film of about 20 μm. Then, using an exposure device equipped with a high-pressure mercury lamp, exposure was performed with a step exposure meter (Kodak No. 2), and the remaining amount of the step exposure sheet after developing (30°C, 0.2MPa, 1...

Embodiment 7~12

[0321] The cover film was peeled off from the dry film obtained as described above, and the film was thermocompression-bonded to a patterned copper foil substrate, followed by exposure under the same conditions as the substrate used for the evaluation of the above-mentioned coating film properties. After the exposure, the carrier film was peeled off, and developed with a 1% sodium carbonate aqueous solution at 30° C. for 90 seconds under a spray pressure of 0.2 MPa to obtain a resist pattern. Through the UV conveyor belt furnace, the cumulative exposure is 1000mJ / cm 2 After irradiating the substrate with ultraviolet rays under certain conditions, it was cured by heating at 150° C. for 60 minutes. Using the above-mentioned evaluation method, performance evaluation and property evaluation were performed on the obtained test substrate having a cured film. The evaluation results are shown in Table 3.

[0322] [table 3]

[0323]

[0324] From the results shown in Table 2 and...

Embodiment 13~20

[0374] Using the resin solution in the above synthesis example, the various components and ratios (parts by mass) shown in Table 4 were mixed, pre-mixed with a mixer, and then kneaded with a 3-roller mill to prepare a photosensitive resin for solder resist. resin composition. Here, the degree of dispersion of the obtained photosensitive resin composition was evaluated by particle size measurement with a blade fineness meter manufactured by ERICH SEN, and it was 15 μm or less.

[0375] In addition, in Table 4, the compositions of Comparative Examples 4 and 6 are the same compositions as those of Comparative Examples 1 and 2 in Table 1, respectively.

[0376] [Table 4]

[0377]

[0378] [Remark]

[0379] *1~*12: Same as Table 1 [Remarks].

[0380] The performance evaluation and characteristic evaluation were performed about the composition of the Example and the comparative example shown in Table 4. The evaluation results are shown in Table 5. In addition, since the ev...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
acid valueaaaaaaaaaa
acid valueaaaaaaaaaa
thicknessaaaaaaaaaa
Login to view more

Abstract

The present invention provides dilute alkali development suitable for obtaining a cured film excellent in adhesion to substrates, chemical resistance, solder heat resistance, PCT resistance, thermal shock resistance, chemical gold plating resistance, electrical insulation, etc. type photocurable thermosetting resin composition. The photocurable thermosetting resin composition of the present invention contains a carboxyl group-containing resin, a photosensitive resin having a structure represented by the following general formulas (1) to (3), and a photopolymerization initiator. (In formula (1), R1 represents a group of the following formula (2); R2 represents a methyl group or an OR1 group; n+m=1.5~6.0, n=0~6.0, m=0~6.0, l=0 ~3, n:m=100:0~0:100.) (In formula (2), R3 represents hydrogen or methyl; R4 represents the group or hydrogen in the following (3); k=0.3~10.0.) (In formula (3), R5 represents hydrogen or methyl).

Description

technical field [0001] The present invention relates to a photocurable thermosetting resin composition used as a solder resist for printed circuit boards, and more particularly to a dilute alkali-developable photocurable thermosetting resin composition suitable for resists for IC packaging. Background technique [0002] At present, from the viewpoint of high precision and high density, some printed circuit boards for commercial use and most industrial printed circuit boards use solder resists that form images by developing after ultraviolet irradiation, use heat and / or A liquid-developable photosensitive solder resist that is finally cured (completely cured) by light irradiation. Among such solder resists, an alkali-developing solder resist using a dilute alkaline aqueous solution as a developing solution has become the mainstream due to environmental considerations, and is widely used in actual production of printed circuit boards. In addition, in response to the increase...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/038C08F290/00G03F7/004H05K3/28
CPCG03F7/032H05K3/287G03F7/0388C08F290/00G03F7/004G03F7/0045G03F7/038G03F7/0382G03F7/202
Inventor 伊藤信人有马圣夫恩田真司曾根嘉久
Owner TAIYO HLDG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap