Nozzle head
A nozzle head, nozzle technology, applied in gaseous chemical plating, metal material coating process, coating and other directions, can solve problems such as complex structure
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[0016] Figure 1A A cross-sectional view of a specific embodiment of an apparatus is shown for subjecting a surface 4 of a substrate 6 to a continuous surface reaction of at least a first precursor A and a second precursor B according to the principle of ALD. The first and second precursors A and B can be any gaseous precursor used in ALD, such as ozone, trimethylaluminum (TMA), water, titanium tetrachloride (TiCl 4 ), diethylzinc (DEZ), or the precursor may also be a plasma, such as ammonia, argon, oxygen, nitrogen, hydrogen, or carbon dioxide plasma. The apparatus includes a process chamber 26 having a gaseous environment 14 therein. The gaseous environment 14 may include an inert gas such as nitrogen, or dry air, or any other gas suitable for use as purge air in an ALD process. In addition, plasmas can be used for flushing eg nitrogen or argon plasmas. Flushing gas herein also includes plasma. A source of flushing gas is connected to the processing chamber 26 for supplyi...
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